Soquetes para CIs, Transistores

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
1437542-6

1437542-6

CONN IC DIP SOCKET 6POS GOLD

TE Connectivity AMP Connectors
3,519 -

RFQ

1437542-6

Ficha técnica

- 700 Obsolete DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100 (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Aluminum Alloy
8058-1G57

8058-1G57

CONN TRANSIST TO-5 8POS GOLD

TE Connectivity AMP Connectors
3,921 -

RFQ

8058-1G57

Ficha técnica

Bulk 8058 Obsolete Transistor, TO-5 8 (Round) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Brass Polytetrafluoroethylene (PTFE)
2-1437530-7

2-1437530-7

CONN SOCKET SIP 7POS

TE Connectivity AMP Connectors
3,047 -

RFQ

2-1437530-7

Ficha técnica

Bulk 500 Obsolete SIP 7 (1 x 7) 0.100 (2.54mm) - - Beryllium Copper Through Hole - Solder 0.100 (2.54mm) - - Beryllium Copper Thermoplastic
2-1437530-9

2-1437530-9

CONN SOCKET SIP 12POS

TE Connectivity AMP Connectors
3,470 -

RFQ

2-1437530-9

Ficha técnica

Bulk 500 Active SIP 12 (1 x 12) 0.100 (2.54mm) - - Beryllium Copper Through Hole - Solder 0.100 (2.54mm) - - Beryllium Copper Thermoplastic
2-1437532-2

2-1437532-2

CONN IC DIP SOCKET 24POS

TE Connectivity AMP Connectors
2,212 -

RFQ

- 500 Obsolete DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) - - - Through Hole Closed Frame - - - - - -
2-1437539-0

2-1437539-0

CONN IC DIP SOCKET 14POS TIN

TE Connectivity AMP Connectors
2,650 -

RFQ

2-1437539-0

Ficha técnica

Tube 800 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Tin - Copper Alloy Through Hole Open Frame Solder 0.100 (2.54mm) - - - Polyester
2-1437540-2

2-1437540-2

CONN IC DIP SOCKET 32POS GOLD

TE Connectivity AMP Connectors
2,615 -

RFQ

2-1437540-2

Ficha técnica

Tube 800 Obsolete DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 5.00µin (0.127µm) Copper Alloy Through Hole Open Frame Solder 0.100 (2.54mm) - - - Polyester
2-1437542-9

2-1437542-9

CONN IC DIP SOCKET 20POS GOLD

TE Connectivity AMP Connectors
3,122 -

RFQ

2-1437542-9

Ficha técnica

- 700 Obsolete DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100 (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Aluminum Alloy
816-AG11D-ESL-LF

816-AG11D-ESL-LF

CONN IC DIP SOCKET 16POS GOLD

TE Connectivity AMP Connectors
3,766 -

RFQ

816-AG11D-ESL-LF

Ficha técnica

Tube 800 Obsolete DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold Flash Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
2-210735-5

2-210735-5

CONN SOCKET SIP 25POS TIN-LEAD

TE Connectivity AMP Connectors
3,464 -

RFQ

Bulk - Obsolete SIP 25 (1 x 25) 0.100 (2.54mm) Tin-Lead - Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin-Lead - - Thermoplastic
2-382467-1

2-382467-1

CONN IC DIP SOCKET 28POS TIN

TE Connectivity AMP Connectors
2,023 -

RFQ

2-382467-1

Ficha técnica

Tube Diplomate DL Obsolete DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Beryllium Copper Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
2-641610-2

2-641610-2

CONN IC DIP SOCKET 16POS GOLD

TE Connectivity AMP Connectors
3,723 -

RFQ

2-641610-2

Ficha técnica

Tube Diplomate DL Obsolete DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper -
210748-5

210748-5

CONN SOCKET PGA 6POS TIN-LEAD

TE Connectivity AMP Connectors
2,547 -

RFQ

210748-5

Ficha técnica

Tube - Obsolete PGA 6 (2 x 3) 0.100 (2.54mm) Tin-Lead 196.9µin (5.00µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) - - Brass Thermoplastic, Polyester, Glass Filled
3-1437504-6

3-1437504-6

CONN TRANSIST TO-3 3POS GOLD

TE Connectivity AMP Connectors
3,563 -

RFQ

3-1437504-6

Ficha técnica

Bulk 8060 Obsolete Transistor, TO-3 3 (Oval) - Gold 50.0µin (1.27µm) Beryllium Copper Chassis Mount Closed Frame Solder - Gold 50.0µin (1.27µm) Beryllium Copper Polytetrafluoroethylene (PTFE)
3-1437508-9

3-1437508-9

CONN TRANSIST TO-5 8POS GOLD

TE Connectivity AMP Connectors
2,177 -

RFQ

Bulk 8058 Obsolete Transistor, TO-5 8 (Round) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Brass Polytetrafluoroethylene (PTFE)
3-1437530-2

3-1437530-2

CONN SOCKET SIP 15POS

TE Connectivity AMP Connectors
2,194 -

RFQ

3-1437530-2

Ficha técnica

Bulk 500 Obsolete SIP 15 (1 x 15) 0.100 (2.54mm) - - Beryllium Copper Through Hole - Solder 0.100 (2.54mm) - - Beryllium Copper Thermoplastic
3-1437531-7

3-1437531-7

CONN IC DIP SOCKET 14POS

TE Connectivity AMP Connectors
2,441 -

RFQ

3-1437531-7

Ficha técnica

Tube 500 Obsolete DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) - - Copper Alloy Through Hole Closed Frame Solder 0.100 (2.54mm) - - Copper Alloy -
3-1437532-4

3-1437532-4

CONN IC DIP SOCKET 28POS GOLD

TE Connectivity AMP Connectors
3,624 -

RFQ

3-1437532-4

Ficha técnica

- 500 Obsolete DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold - - Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold - - -
3-1437537-0

3-1437537-0

CONN IC DIP SOCKET 14POS TINLEAD

TE Connectivity AMP Connectors
2,794 -

RFQ

3-1437537-0

Ficha técnica

Tube 800 Obsolete DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Tin-Lead - Copper Alloy Surface Mount Open Frame Solder 0.100 (2.54mm) - - - Polyester
3-1437537-5

3-1437537-5

CONN IC DIP SOCKET 14POS GOLD

TE Connectivity AMP Connectors
3,099 -

RFQ

3-1437537-5

Ficha técnica

Tube 800 Obsolete DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100 (2.54mm) - - - Polyester
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1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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