Mais categorias de produtos

Soquetes para CIs, Transistores

Número da peça do fabricante	Disponibilidade	Preço	Quantidade	Ficha técnica	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
799288-1 CONN IC DIP SOCKET 16POS TINLEAD TE Connectivity AMP Connectors	2,918	-	RFQ	Ficha técnica	Box	-	Obsolete	DIP, 0.3 (7.62mm) Row Spacing	16 (2 x 8)	0.100 (2.54mm)	Tin-Lead	3.00µin (0.076µm)	Beryllium Copper	Through Hole	Closed Frame, Elevated	Solder	0.100 (2.54mm)	Tin-Lead	5.00µin (0.127µm)	Brass	Thermoplastic, Polyester, Glass Filled
8-1437532-2 CONN IC DIP SOCKET 40POS TE Connectivity AMP Connectors	2,630	-	RFQ	Ficha técnica	-	500	Obsolete	DIP, 0.6 (15.24mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	-	-	-	Through Hole	Closed Frame	Wire Wrap	0.100 (2.54mm)	-	-	-	-
8-1437532-3 CONN IC DIP SOCKET 40POS TINLEAD TE Connectivity AMP Connectors	2,398	-	RFQ	Ficha técnica	Bulk	500	Active	DIP, 0.6 (15.24mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Tin-Lead	-	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin-Lead	-	Beryllium Copper	Polyester
540AG12DES CONN IC DIP SOCKET 40POS TINLEAD TE Connectivity AMP Connectors	2,101	-	RFQ	Ficha técnica	Bulk	500	Obsolete	DIP, 0.6 (15.24mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Tin-Lead	-	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	-	-	Brass	-
824-AG12D CONN IC DIP SOCKET 24POS TINLEAD TE Connectivity AMP Connectors	3,309	-	RFQ	Ficha técnica	Tube	800	Active	DIP, 0.6 (15.24mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Tin-Lead	80.0µin (2.03µm)	Copper Alloy	Through Hole	Open Frame	Solder	0.100 (2.54mm)	-	-	-	Polyester
9-1437530-4 CONN SOCKET SIP 11POS TE Connectivity AMP Connectors	2,243	-	RFQ	Ficha técnica	Bulk	500	Obsolete	SIP	11 (1 x 11)	0.100 (2.54mm)	-	-	Beryllium Copper	Through Hole	-	Solder	0.100 (2.54mm)	-	-	Beryllium Copper	Thermoplastic
9-1437530-5 CONN SOCKET SIP 12POS TE Connectivity AMP Connectors	3,290	-	RFQ	Ficha técnica	Bulk	500	Obsolete	SIP	12 (1 x 12)	0.100 (2.54mm)	-	-	Beryllium Copper	Through Hole	-	Solder	0.100 (2.54mm)	-	-	Beryllium Copper	Thermoplastic
824-AG32D CONN IC DIP SOCKET 24POS TINLEAD TE Connectivity AMP Connectors	3,717	-	RFQ	Ficha técnica	Tube	800	Obsolete	DIP, 0.3 (7.62mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Tin-Lead	80.0µin (2.03µm)	Copper Alloy	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	-	Copper Alloy	Polyester
1-1437538-6 CONN IC DIP SOCKET 28POS GOLD TE Connectivity AMP Connectors	2,718	-	RFQ	Ficha técnica	Tube	800	Obsolete	DIP, 0.6 (15.24mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	20.0µin (0.51µm)	Copper Alloy	Through Hole	Open Frame	Solder	0.100 (2.54mm)	-	-	-	Polyester
1-390261-5 CONN IC DIP SOCKET 18POS TIN TE Connectivity AMP Connectors	2,437	-	RFQ	Ficha técnica	Tube	-	Obsolete	DIP, 0.3 (7.62mm) Row Spacing	18 (2 x 9)	0.100 (2.54mm)	Tin	60.0µin (1.52µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	60.0µin (1.52µm)	Phosphor Bronze	-
1437504-7 CONN TRANSIST TO-5 8POS GOLD TE Connectivity AMP Connectors	2,032	-	RFQ		Bulk	8060	Obsolete	Transistor, TO-5	8 (Round)	-	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	-	Gold	-	Beryllium Copper	Polytetrafluoroethylene (PTFE)
2-1437531-5 CONN IC DIP SOCKET 14POS TIN TE Connectivity AMP Connectors	2,849	-	RFQ		Tube	500	Obsolete	DIP, 0.3 (7.62mm) Row Spacing	14 (2 x 7)	0.100 (2.54mm)	Tin	-	Copper Alloy	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	-	Copper Alloy	-
2-1437542-2 CONN IC DIP SOCKET 18POS GOLD TE Connectivity AMP Connectors	2,150	-	RFQ	Ficha técnica	-	700	Obsolete	DIP, 0.3 (7.62mm) Row Spacing	18 (2 x 9)	0.100 (2.54mm)	Gold	20.0µin (0.51µm)	Beryllium Copper	Through Hole, Right Angle, Vertical	Carrier, Closed Frame	Solder	0.100 (2.54mm)	Gold	20.0µin (0.51µm)	Beryllium Copper	Aluminum Alloy
2-382515-3 CONN IC DIP SOCKET 20POS TIN TE Connectivity AMP Connectors	2,200	-	RFQ	Ficha técnica	Box	Diplomate DL	Obsolete	DIP, 0.3 (7.62mm) Row Spacing	20 (2 x 10)	0.100 (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Phosphor Bronze	Thermoplastic, Glass Filled
8080-1G13 CONN TRANSIST TO-3 3POS TIN TE Connectivity AMP Connectors	2,554	-	RFQ	Ficha técnica	Bulk	8060	Obsolete	Transistor, TO-3	3 (Oval)	-	Tin-Lead	-	Beryllium Copper	Chassis Mount	Closed Frame	Solder	-	Tin-Lead	-	Beryllium Copper	Polytetrafluoroethylene (PTFE)
3-1437530-1 CONN SOCKET SIP 14POS GOLD TE Connectivity AMP Connectors	2,167	-	RFQ	Ficha técnica	Bulk	500	Obsolete	SIP	14 (1 x 14)	0.100 (2.54mm)	Gold	-	Beryllium Copper	Through Hole	-	Solder	0.100 (2.54mm)	Gold	-	Beryllium Copper	Thermoplastic
3-1437530-3 CONN SOCKET SIP 16POS GOLD TE Connectivity AMP Connectors	3,172	-	RFQ	Ficha técnica	Bulk	500	Obsolete	SIP	16 (1 x 16)	0.100 (2.54mm)	Gold	-	Beryllium Copper	Through Hole	-	Solder	0.100 (2.54mm)	Gold	-	Beryllium Copper	Thermoplastic
520-AG12D-ES CONN IC DIP SOCKET 20POS TINLEAD TE Connectivity AMP Connectors	3,362	-	RFQ	Ficha técnica	Bulk	500	Active	DIP, 0.3 (7.62mm) Row Spacing	20 (2 x 10)	0.100 (2.54mm)	Tin-Lead	-	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	-	-	Brass	-
8080-1G25 CONN TRANSIST TO-3 3POS GOLD TE Connectivity AMP Connectors	3,293	-	RFQ	Ficha técnica	Bulk	8060	Obsolete	Transistor, TO-3	3 (Oval)	-	Gold	-	Beryllium Copper	Chassis Mount	Closed Frame	Solder	-	Gold	-	Beryllium Copper	Polytetrafluoroethylene (PTFE)
4-1437508-0 CONN TRANSIST TO-5 8POS GOLD TE Connectivity AMP Connectors	2,378	-	RFQ		Bulk,Bulk	8058	Obsolete	Transistor, TO-5	8 (Round)	-	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	-	Gold	-	Beryllium Copper	Polytetrafluoroethylene (PTFE)