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Térmico - dissipadores de calor
| Foto: | Número da peça do fabricante | Disponibilidade | Preço | Quantidade | Ficha técnica | Packaging | Series | ProductStatus | Type | PackageCooled | AttachmentMethod | Shape | Length | Width | Diameter | FinHeight | PowerDissipation@TemperatureRise | ThermalResistance@ForcedAirFlow | ThermalResistance@Natural | Material |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
V6560YHEATSINK ALUM ANOD Assmann WSW Components |
2,103 | - |
RFQ |
Ficha técnica |
Tray | - | Active | Board Level | Bolt On and PC Pin | Rectangular, Fins | 1.969 (50.00mm) | 1.181 (30.00mm) | - | 0.472 (12.00mm) | - | - | 7.00°C/W | Aluminum | |
|
V8813XHEATSINK TO-220/TOP-3/SOT-32 Assmann WSW Components |
2,404 | - |
RFQ |
Ficha técnica |
Tray | - | Active | Board Level, Vertical | Bolt On and PC Pin | Rectangular, Fins | 1.496 (38.00mm) | 1.359 (34.50mm) | - | 0.492 (12.50mm) | - | - | 5.00°C/W | Aluminum | |
|
HSB08-212106HEAT SINK, BGA, 21 X 21 X 6 MM CUI Devices |
3,713 | - |
RFQ |
Ficha técnica |
Box | HSB | Active | Top Mount | Adhesive | Square, Pin Fins | 0.827 (21.00mm) | 0.827 (21.00mm) | - | 0.236 (6.00mm) | 3.0W @ 75°C | 9.70°C/W @ 200 LFM | 25.40°C/W | Aluminum Alloy | |
|
HSB09-212115HEAT SINK, BGA, 21 X 21 X 15 MM CUI Devices |
3,353 | - |
RFQ |
Ficha técnica |
Box | HSB | Active | Top Mount | Adhesive | Square, Pin Fins | 0.827 (21.00mm) | 0.827 (21.00mm) | - | 0.591 (15.00mm) | 4.3W @ 75°C | 6.00°C/W @ 200 LFM | 17.39°C/W | Aluminum Alloy | |
|
HSB05-171711HEAT SINK, BGA, 17 X 17 X 11.5 M CUI Devices |
3,624 | - |
RFQ |
Ficha técnica |
Box | HSB | Active | Top Mount | Adhesive | Square, Pin Fins | 0.669 (17.00mm) | 0.669 (17.00mm) | - | 0.453 (11.50mm) | 3.1W @ 75°C | 8.40°C/W @ 200 LFM | 23.91°C/W | Aluminum Alloy | |
|
DA-T263-201E-TRHEATSINK FOR TO-263 Ohmite |
2,060 | - |
RFQ |
Ficha técnica |
Tape & Reel (TR),Cut Tape (CT) | D | Active | Top Mount | Solderable Feet | Rectangular, Fins | 0.500 (12.70mm) | 1.020 (25.91mm) | - | 0.480 (12.19mm) | 2.0W @ 30°C | 8.00°C/W @ 500 LFM | - | Aluminum | |
|
HSE-B20250-045HHEAT SINK, EXTRUSION, TO-220, 50 CUI Devices |
2,957 | - |
RFQ |
Ficha técnica |
Box | HSE | Active | Board Level, Vertical | Bolt On and PC Pin | Rectangular, Fins | 1.969 (50.00mm) | 1.181 (30.00mm) | - | 0.472 (12.00mm) | 7.7W @ 75°C | 4.05°C/W @ 200 LFM | 9.74°C/W | Aluminum Alloy | |
|
577404B00000GHEATSINK TO-202 LOW PROFILE .5 Aavid, Thermal Division of Boyd Corporation |
3,418 | - |
RFQ |
Ficha técnica |
Bag | - | Active | Board Level | Bolt On | Rectangular, Fins | 0.750 (19.05mm) | 0.520 (13.21mm) | - | 0.500 (12.70mm) | 2.0W @ 50°C | 10.00°C/W @ 200 LFM | 24.00°C/W | Aluminum | |
|
TGH-0200-02ALUMINIUM HEAT SINK 20X20MM t-Global Technology |
2,604 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Top Mount | - | Square, Fins | 0.787 (20.00mm) | 0.787 (20.00mm) | - | 0.236 (6.00mm) | - | - | - | Aluminum | |
|
E2A-T220-25EBLACK ANODIZED HEATSINK Ohmite |
589 | - |
RFQ |
Ficha técnica |
Box | EX | Active | Board Level, Vertical | Bolt On and Board Mounts | Rectangular, Fins | 0.641 (16.28mm) | 0.642 (16.30mm) | - | 1.000 (25.40mm) | 2.0W @ 40°C | 4.00°C/W @ 500 LFM | 16.40°C/W | Aluminum | |
|
HSB21-454515HEAT SINK, BGA, 45 X 45 X 15 MM CUI Devices |
3,430 | - |
RFQ |
Ficha técnica |
Box | HSB | Active | Top Mount | Adhesive | Square, Pin Fins | 1.772 (45.00mm) | 1.772 (45.00mm) | - | 0.591 (15.00mm) | 9.9W @ 75°C | 2.80°C/W @ 200 LFM | 7.56°C/W | Aluminum Alloy | |
|
530714B00000GHEATSINK TO-220 LIGHTWEIGHT .5 Aavid, Thermal Division of Boyd Corporation |
2,970 | - |
RFQ |
Ficha técnica |
Bag | - | Active | Board Level | Bolt On | Rectangular, Fins | 0.710 (18.03mm) | 1.000 (25.40mm) | - | 0.500 (12.70mm) | 2.0W @ 40°C | 4.00°C/W @ 700 LFM | 20.30°C/W | Aluminum | |
|
TGH-0220-03ALUMINIUM HEAT SINK 22X22MM t-Global Technology |
220 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Top Mount | - | Square, Pin Fins | 0.866 (22.00mm) | 0.866 (22.00mm) | - | 0.354 (9.00mm) | - | - | - | Aluminum | |
|
658-25ABT4EHEATSINK CPU 28MM SQ BLK W/TAPE Wakefield-Vette |
2,560 | - |
RFQ |
Ficha técnica |
Bulk | 658 | Active | Top Mount | Adhesive | Square, Pin Fins | 1.100 (27.94mm) | 1.100 (27.94mm) | - | 0.250 (6.35mm) | 2.0W @ 40°C | 5.00°C/W @ 500 LFM | - | Aluminum | |
|
542502B00000GHEATSINK TO-220 TAB BLACK Aavid, Thermal Division of Boyd Corporation |
2,277 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Board Level, Vertical | Bolt On and PC Pin | Rectangular, Fins | 1.250 (31.75mm) | 0.875 (22.22mm) | - | 0.250 (6.35mm) | 2.5W @ 60°C | 4.00°C/W @ 700 LFM | 24.00°C/W | Aluminum | |
|
658-60ABT3HEATSINK CPU 28MM SQ BLK W/TAPE Wakefield-Vette |
3,889 | - |
RFQ |
Ficha técnica |
Bulk | 658 | Active | Top Mount | Thermal Tape, Adhesive (Included) | Square, Pin Fins | 1.100 (27.94mm) | 1.100 (27.94mm) | - | 0.598 (15.20mm) | 2.5W @ 30°C | 2.00°C/W @ 500 LFM | - | Aluminum | |
|
7142DGHEATSINK TO-220 TIN CLIP-ON 21MM Aavid, Thermal Division of Boyd Corporation |
3,765 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Board Level | Clip and Board Locks | Rectangular, Fins | 0.780 (19.81mm) | 0.520 (13.21mm) | - | 0.515 (13.08mm) | 1.0W @ 30°C | 8.00°C/W @ 400 LFM | 20.30°C/W | Copper | |
|
BDN10-3CB/A01HEATSINK CPU W/ADHESIVE 1.01SQ CTS Thermal Management Products |
3,159 | - |
RFQ |
Ficha técnica |
Box | BDN | Active | Top Mount | Thermal Tape, Adhesive (Included) | Square, Pin Fins | 1.010 (25.65mm) | 1.010 (25.65mm) | - | 0.355 (9.02mm) | - | 8.00°C/W @ 400 LFM | 26.40°C/W | Aluminum | |
|
ATS-CPX050050010-121-C1-R0HEATSINK 50X50X10MM XCUT CP Advanced Thermal Solutions Inc. |
2,840 | - |
RFQ |
Ficha técnica |
Tray | pushPIN™ | Active | Top Mount | Push Pin | Square, Fins | 1.969 (50.00mm) | 1.969 (50.00mm) | - | 0.394 (10.00mm) | - | 9.46°C/W @ 100 LFM | - | Aluminum | |
|
ATS-CPX025025025-140-C1-R0HEATSINK 25X25X25MM L-TAB CP Advanced Thermal Solutions Inc. |
2,501 | - |
RFQ |
Ficha técnica |
Tray | pushPIN™ | Active | Top Mount | Push Pin | Square, Fins | 0.984 (25.00mm) | 0.984 (25.00mm) | - | 0.984 (25.00mm) | - | 7.21°C/W @ 100 LFM | - | Aluminum |
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