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Térmico - dissipadores de calor
| Foto: | Número da peça do fabricante | Disponibilidade | Preço | Quantidade | Ficha técnica | Packaging | Series | ProductStatus | Type | PackageCooled | AttachmentMethod | Shape | Length | Width | Diameter | FinHeight | PowerDissipation@TemperatureRise | ThermalResistance@ForcedAirFlow | ThermalResistance@Natural | Material |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
342940COPPER HEATSINK 38.5X37.6X14MM Aavid, Thermal Division of Boyd Corporation |
2,064 | - |
RFQ |
Ficha técnica |
Tray | - | Active | Top Mount, Skived | Push Pin | Rectangular, Fins | 1.480 (37.59mm) | 1.516 (38.50mm) | - | 0.551 (14.00mm) | - | 2.60°C/W @ 200 LFM | 15.90°C/W | Copper | |
|
40532BOM ASSY 4623 LF PUSHPIN HTSNK Vicor Corporation |
2,507 | - |
RFQ |
Bulk | * | Active | - | - | - | - | - | - | - | - | - | - | - | ||
|
DHS-B9292-04AHEATSINK ASSY INTEL LGA2011 Delta Electronics |
2,343 | - |
RFQ |
Ficha técnica |
Box | - | Active | Board Level | Bolt On | Square, Fins | 3.602 (91.50mm) | 3.602 (91.50mm) | - | 1.004 (25.50mm) | - | - | 0.24°C/W | Aluminum | |
|
|
40141BOM, ASSEMBLY, 6123 XF PUSH PI Vicor Corporation |
2,192 | - |
RFQ |
Bulk | * | Active | - | - | - | - | - | - | - | - | - | - | - | ||
|
|
TXP050822BHEAT SINK ELECT ISO TO-5 W/HRDWR CTS Thermal Management Products |
3,934 | - |
RFQ |
Tray | - | Active | - | - | - | - | - | - | - | - | - | - | - | ||
|
|
40533BOM ASSY 6123 XF PUSHPIN HTSNK Vicor Corporation |
3,092 | - |
RFQ |
Bulk | * | Active | - | - | - | - | - | - | - | - | - | - | - | ||
|
|
40534BOM ASSY 6123 LF PUSHPIN HTSNK Vicor Corporation |
3,660 | - |
RFQ |
Bulk | * | Active | - | - | - | - | - | - | - | - | - | - | - | ||
|
342943COPPER HEATSINK 50X50X14MM Aavid, Thermal Division of Boyd Corporation |
3,025 | - |
RFQ |
Ficha técnica |
Tray | - | Active | Top Mount, Skived | Push Pin | Square, Fins | 1.969 (50.00mm) | 1.969 (50.00mm) | - | 0.551 (14.00mm) | - | 2.10°C/W @ 200 LFM | 8.90°C/W | Copper | |
|
FHS-A6025B02AFAN CPU COOLER 91.5X91.5MM 12VDC Delta Electronics |
2,144 | - |
RFQ |
Ficha técnica |
Box | FHS | Active | Board Level | Bolt On | Square, Fins | 3.602 (91.50mm) | 3.602 (91.50mm) | - | 2.519 (64.00mm) | - | - | 0.18°C/W | Aluminum, Copper, Plastic | |
|
|
7-1542004-1HTS93-A=HS ASSY AL CLIP TE Connectivity AMP Connectors |
3,645 | - |
RFQ |
Ficha técnica |
Tray | - | Active | Top Mount | Clip | Cylindrical | - | - | 2.490 (63.25mm) OD | 0.433 (11.00mm) | - | - | - | Aluminum | |
|
342947COPPER HEATSINK 57.9X59X11MM Aavid, Thermal Division of Boyd Corporation |
3,792 | - |
RFQ |
Ficha técnica |
Tray | - | Active | Top Mount, Skived | Push Pin | Rectangular, Fins | 2.323 (59.00mm) | 2.280 (57.91mm) | - | 0.433 (11.00mm) | - | 1.90°C/W @ 200 LFM | 7.70°C/W | Copper | |
|
FHS-K8020S00FAN CPU COOLER 80X22MM 12VDC Delta Electronics |
2,027 | - |
RFQ |
Ficha técnica |
Box | FHS | Active | Board Level | Bolt On | Rectangular | 7.843 (199.21mm) | 3.481 (88.42mm) | - | 1.035 (26.30mm) | - | - | 0.37°C/W | Aluminum, Copper, Plastic | |
|
|
KK0808-03HEAT SPREADER FOR MPSOC TE0808 Trenz Electronic GmbH |
2,757 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Heat Spreader | Bolt On | Rectangular | 2.992 (76.00mm) | 2.047 (52.00mm) | - | 0.354 (9.00mm) | - | - | - | - | |
|
|
40519BOM ASSY 4623 DUAL HTSNK 11MM Vicor Corporation |
3,703 | - |
RFQ |
Bulk | * | Active | - | - | - | - | - | - | - | - | - | - | - | ||
|
|
ACC-HS3-SETACC HEATSINK ME ACC-HS3 Enclustra FPGA Solutions |
2,245 | - |
RFQ |
Box | ACC-HS3 | Active | - | Bolt On | Rectangular | 2.205 (56.00mm) | 1.063 (27.00mm) | - | 0.571 (14.50mm) | - | - | - | - | ||
|
|
1542009-2HEAT SINK ASSY 29MM TE Connectivity AMP Connectors |
200 | - |
RFQ |
Ficha técnica |
Tray,Box | - | Active | Top Mount | Clip | Cylindrical | - | - | 1.250 (31.75mm) OD | 0.600 (15.24mm) | - | 5.49°C/W @ 200 LFM | 12.20°C/W | Aluminum | |
|
|
3-1542006-3V-2461 = 47.5MM HS ASSY ALUM C TE Connectivity AMP Connectors |
2,118 | - |
RFQ |
Bulk | - | Active | - | - | - | - | - | - | - | - | - | - | - | ||
|
342948COPPER HEATSINK 70X69X14MM Aavid, Thermal Division of Boyd Corporation |
3,852 | - |
RFQ |
Ficha técnica |
Tray | - | Active | Top Mount, Skived | Push Pin | Square, Fins | 2.717 (69.00mm) | 2.756 (70.00mm) | - | 0.551 (14.00mm) | - | 1.40°C/W @ 200 LFM | 5.60°C/W | Copper | |
|
|
435AAAAHEAT SINK, B4547AAAA REV Wakefield-Vette |
2,908 | - |
RFQ |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | ||
|
1253805WX36 EXTRUSION 16414 XX7332 Wakefield-Vette |
2,983 | - |
RFQ |
Ficha técnica |
Box | - | Active | Top Mount, Extrusion | Adhesive | Rectangular, Fins | 36.000 (914.40mm) | 5.000 (127.00mm) | - | 1.500 (38.10mm) | - | - | 0.63°C/W | Aluminum |
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