RFI e EMI - Contatos, Fingerstock e juntas

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus Type Shape Width Length Height Material Plating Plating-Thickness AttachmentMethod
0098061117

0098061117

CLO,STR,TLN,SNB,USFT

Laird Technologies EMI
3,811 -

RFQ

0098061117

Ficha técnica

Bulk Ultrasoft Clip-On Active Fingerstock - 0.300 (7.62mm) 16.000 (406.40mm) 0.100 (2.54mm) Beryllium Copper Tin 299.21µin (7.60µm) Clip
0098061317

0098061317

CLO,STR,DLN,SNB,USF

Laird Technologies EMI
3,664 -

RFQ

0098061317

Ficha técnica

Bulk Ultrasoft Clip-On Active Fingerstock - 0.300 (7.62mm) 16.000 (406.40mm) 0.100 (2.54mm) Beryllium Copper Tin 299.21µin (7.60µm) Clip
4741PA51H03937

4741PA51H03937

GK,NICU,PTAFG,PU,V0,REC 4X6.5X10

Laird Technologies EMI
2,890 -

RFQ

Bulk 51H Active Fabric Over Foam Rectangle 0.256 (6.50mm) 39.370 (1.00m) 0.157 (3.99mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive
0077007302

0077007302

NOSG STR BF PSA

Laird Technologies EMI
3,454 -

RFQ

Box No Snag Active - - 0.319 (8.10mm) 24.000 (609.60mm) - - - - -
4184PAX1R03937

4184PAX1R03937

GK,NICU,PTAFG,PU,V0,DSH .060X.15

Laird Technologies EMI
2,604 -

RFQ

Bulk EcoTemp™ 85 X1R Active Fabric Over Foam D-Shape 0.150 (3.81mm) 39.370 (1.00m) 0.630 (16.00mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive
8865-0120-80

8865-0120-80

DSTRSD,ECE080 .062X.100X.031

Laird Technologies EMI
2,656 -

RFQ

Bulk Electroseal™ EcE80 Active - - - - - - - - -
0097036002

0097036002

CSTR,STR,BF

Laird Technologies EMI
3,468 -

RFQ

0097036002

Ficha técnica

Bulk Contact Strip Active Fingerstock - - - - Beryllium Copper - - Slot
8516-0162-56

8516-0162-56

EMOW,SILSD,MON,DC 0.032X1.467X1.

Laird Technologies EMI
3,372 -

RFQ

Bulk - Active - - - - - - - - -
0098062117

0098062117

CLO,STR,TLN,SNB,USFT

Laird Technologies EMI
2,458 -

RFQ

0098062117

Ficha técnica

Bulk Ultrasoft Clip-On Active Fingerstock - 0.440 (11.18mm) 16.000 (406.40mm) 0.120 (3.05mm) Beryllium Copper Tin 299.21µin (7.60µm) Clip
4056AB51K04800

4056AB51K04800

GK NICU NRS PU V0 REC

Laird Technologies EMI
2,171 -

RFQ

4056AB51K04800

Ficha técnica

Bulk 51K Active Fabric Over Foam Rectangle 0.201 (5.10mm) 48.000 (121.92cm) 0.059 (1.50mm) Polyurethane Foam, Nickel-Copper Polyester (NI/CU) - - -
4164PA51H02000

4164PA51H02000

GK NICU PTAFG PU V0 REC

Laird Technologies EMI
3,481 -

RFQ

4164PA51H02000

Ficha técnica

Bulk 51H Active Fabric Over Foam Rectangle 0.752 (19.10mm) 20.000 (508.00mm) 0.059 (1.50mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive
0078004317

0078004317

NOSG,STR,SNB,USFT,PSA

Laird Technologies EMI
2,894 -

RFQ

0078004317

Ficha técnica

Bulk Ultrasoft Slot Mount Active Fingerstock - 0.450 (11.43mm) 0.262 (6.67mm) 0.080 (2.03mm) Beryllium Copper Tin 299.21µin (7.60µm) Adhesive
0078004319

0078004319

NOSG,STR,NIB,USFT,PSA

Laird Technologies EMI
2,026 -

RFQ

0078004319

Ficha técnica

Bulk Ultrasoft Slot Mount Active Fingerstock - 0.450 (11.43mm) 0.262 (6.67mm) 0.080 (2.03mm) Beryllium Copper Nickel 299.21µin (7.60µm) Adhesive
0078007119

0078007119

NOSG,STR,NIB,USFT,PSA

Laird Technologies EMI
3,448 -

RFQ

0078007119

Ficha técnica

Bulk Ultrasoft Hook-on Active Fingerstock - 0.450 (11.43mm) 16.200 (411.48mm) 0.122 (3.10mm) Beryllium Copper Nickel 299.21µin (7.60µm) Slot
0C97043817

0C97043817

CSTR COIL SNB

Laird Technologies EMI
3,162 -

RFQ

Bulk Large Enclosure Active Fingerstock - 1.090 (27.69mm) 25.00' (7.60m) 0.250 (6.35mm) Beryllium Copper Tin 299.99µin (7.62µm) Hardware, Rivet, Solder
0C97043819

0C97043819

CSTR COIL NIB

Laird Technologies EMI
3,465 -

RFQ

Bulk Large Enclosure Active Fingerstock - 1.090 (27.69mm) 25.00' (7.60m) 0.250 (6.35mm) Beryllium Copper Nickel 299.99µin (7.62µm) Hardware, Rivet, Solder
4789AC51H01800

4789AC51H01800

GK,NICU,PTAFG,PU,V0,DSH .250X.37

Laird Technologies EMI
3,839 -

RFQ

Bulk 51H Active Fabric Over Foam D-Shape 0.375 (9.53mm) 18.000 (457.20mm) 0.250 (6.35mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive
7800-9070-78

7800-9070-78

.250X.500X.125 COMBO W/ ADH--

Leader Tech Inc.
2,802 -

RFQ

7800-9070-78

Ficha técnica

Bulk - Active Gasket Rectangle 0.500 (12.70mm) - 0.250 (6.35mm) - - - -
0077004902

0077004902

GASKET BECU 15.24X406.4MM

Laird Technologies EMI
2,493 -

RFQ

0077004902

Ficha técnica

Box Slot Mount Active Fingerstock - 0.600 (15.24mm) 0.347 (8.81mm) 0.120 (3.05mm) Beryllium Copper - - Adhesive
4078PA51H03937

4078PA51H03937

GK,NICU,PTAFG,PU,V0,DSH 3X9.1X10

Laird Technologies EMI
2,059 -

RFQ

Bulk 51H Active Fabric Over Foam D-Shape 0.360 (9.14mm) 39.370 (1.00m) 0.120 (3.05mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive
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1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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