RFI e EMI - Contatos, Fingerstock e juntas

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus Type Shape Width Length Height Material Plating Plating-Thickness AttachmentMethod
4094PAX1R03937

4094PAX1R03937

GK,NICU,PTAFG,PU,V0,REC .080X.16

Laird Technologies EMI
3,039 -

RFQ

Bulk EcoTemp™ 85 X1R Active Fabric Over Foam Rectangle 0.160 (4.06mm) 39.370 (1.00m) 0.080 (2.03mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive
11-28FS-NI-16-NTP

11-28FS-NI-16-NTP

0.11 X 0.28 NI 16 NTP--FOLDED SE

Leader Tech Inc.
2,653 -

RFQ

11-28FS-NI-16-NTP

Ficha técnica

Bulk - Active Fingerstock - 0.280 (7.11mm) 16.000 (406.40mm) 0.110 (2.79mm) Beryllium Copper Nickel Flash Adhesive
4046PAX1R03937

4046PAX1R03937

GK,NICU,PTAFG,PU,V0,SQ .118X.118

Laird Technologies EMI
2,149 -

RFQ

Bulk EcoTemp™ 85 X1R Active Fabric Over Foam Square 0.118 (3.00mm) 39.370 (1.00m) 0.118 (3.00mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive
0097011102

0097011102

CSTR,STR,BF

Laird Technologies EMI
2,785 -

RFQ

0097011102

Ficha técnica

Bulk Contact Strip Active Fingerstock - - - - Beryllium Copper - - Slot
4609PA51H03937

4609PA51H03937

GK,NICU,PTAF,PU,V0,DSH 0.18X0.4X

Laird Technologies EMI
3,480 -

RFQ

Bulk 51H Active Fabric Over Foam D-Shape 0.400 (10.16mm) 39.370 (1.00m) 0.180 (4.57mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive
0097097502

0097097502

FINGERSTOCK BECU 20.32X474.98MM

Laird Technologies EMI
3,045 -

RFQ

0097097502

Ficha técnica

Bulk Longitudinal Grounding Active Fingerstock - 0.800 (20.32mm) 18.750 (476.25mm) 0.300 (7.62mm) Beryllium Copper - - Hardware
8560-0158-80

8560-0158-80

FLATWASHER,ECE080 .250X.562X.060

Laird Technologies EMI
2,784 -

RFQ

Bulk GEMINI™ Active Gasket Round 0.563 (14.30mm) - 0.059 (1.50mm) - - - -
4220PAX1R03937

4220PAX1R03937

GK,NICU,PTAFG,PU,V0,REC .040X.20

Laird Technologies EMI
2,785 -

RFQ

Bulk EcoTemp™ 85 X1R Active Fabric Over Foam Rectangle 0.200 (5.08mm) 39.370 (1.00m) 0.040 (1.02mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive
4742PAX1R03937

4742PAX1R03937

GK,NICU,PTAFG,PU,V0,DSH .120X.15

Laird Technologies EMI
3,575 -

RFQ

Bulk EcoTemp™ 85 X1R Active Fabric Over Foam D-Shape 0.150 (3.81mm) 39.370 (1.00m) 0.120 (3.05mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive
4208PA51H02400

4208PA51H02400

GASKET FAB/FOAM 10X609.6MM RECT

Laird Technologies EMI
3,518 -

RFQ

4208PA51H02400

Ficha técnica

Bulk 51H Active Fabric Over Foam Rectangle 0.394 (10.00mm) 24.000 (609.60mm) 1.000 (25.40mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive
4216PA51G01800

4216PA51G01800

RECTANGLE

Laird Technologies EMI
2,865 -

RFQ

4216PA51G01800

Ficha técnica

Bulk 51G Active Fabric Over Foam Rectangle 0.394 (10.00mm) 18.000 (457.20mm) 0.315 (8.00mm) - - - Adhesive
0077008502

0077008502

GASKET BECU 15.24X457.2MM

Laird Technologies EMI
3,773 -

RFQ

0077008502

Ficha técnica

Box No Snag Active Fingerstock - 0.600 (15.24mm) 18.000 (457.20mm) 0.220 (5.59mm) Beryllium Copper - - Adhesive
0C97054102

0C97054102

NOSG COIL BF PSA

Laird Technologies EMI
2,270 -

RFQ

0C97054102

Ficha técnica

Bulk Foldover Active Fingerstock - 0.380 (9.65mm) 16.000 (406.40mm) 0.120 (3.05mm) Beryllium Copper Unplated - Adhesive
4286PA51H03937

4286PA51H03937

GK,NICU,PTAFG,PU,V0,REC 3X10X100

Laird Technologies EMI
2,032 -

RFQ

Bulk 51H Active Fabric Over Foam Rectangle 0.394 (10.01mm) 39.370 (1.00m) 0.118 (3.00mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive
0078005717

0078005717

VSLMT,STR,SNB,USFT

Laird Technologies EMI
3,348 -

RFQ

0078005717

Ficha técnica

Bulk Ultrasoft Variable Slot Mount Active Fingerstock - 0.600 (15.24mm) 16.000 (406.40mm) 0.220 (5.59mm) Beryllium Copper Tin 299.21µin (7.60µm) Slot
0078005719

0078005719

VSLMT,STR,NIB,USFT

Laird Technologies EMI
2,645 -

RFQ

0078005719

Ficha técnica

Bulk Ultrasoft Variable Slot Mount Active Fingerstock - 0.600 (15.24mm) 16.000 (406.40mm) 0.220 (5.59mm) Beryllium Copper Nickel 299.21µin (7.60µm) Slot
0077007917

0077007917

NOSG,STR,SNB,PSA .100X.320X.156X

Laird Technologies EMI
3,182 -

RFQ

Bulk 77 Active Fingerstock - 0.320 (8.13mm) 16.000 (406.40mm) 0.100 (2.54mm) Beryllium Copper Tin 299.21µin (7.60µm) Adhesive
0097053617

0097053617

AP,STR,SNB,PSA

Laird Technologies EMI
3,975 -

RFQ

0097053617

Ficha técnica

Bulk All-Purpose Active Fingerstock - 0.670 (17.02mm) 24.000 (609.60mm) 0.310 (7.87mm) Beryllium Copper Tin 299.21µin (7.60µm) Adhesive
0098022117

0098022117

CSTR,STR,SNB,USFT

Laird Technologies EMI
2,330 -

RFQ

Bulk Ultrasoft Contact Strip Active Fingerstock - - - - Beryllium Copper - - Slot
8406010960

8406010960

ENSL,NEOSP,SCF,PSA,RL .125X.250

Laird Technologies EMI
3,724 -

RFQ

Bulk - Active - - - - - - - -
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1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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