RFI e EMI - Contatos, Fingerstock e juntas

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus Type Shape Width Length Height Material Plating Plating-Thickness AttachmentMethod
4242PA51H03937

4242PA51H03937

GK,NICU,PTAFG,PU,V0,DSH 6.4X6.4X

Laird Technologies EMI
2,046 -

RFQ

Bulk 51H Active Fabric Over Foam D-Shape 0.250 (6.35mm) 39.370 (1.00m) 0.250 (6.35mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive
8563-0076-89

8563-0076-89

ORING,ECE089 1.8X20.3MM

Laird Technologies EMI
3,153 -

RFQ

Bulk Electroseal™ EcE89 Active - - - - - - - - -
8863-0140-89

8863-0140-89

OSTRSD,ECE089 3.0MM

Laird Technologies EMI
3,625 -

RFQ

Bulk Electroseal™ EcE89 Active - - - - - - - - -
4677AK51H01800

4677AK51H01800

SHIELDING GASKET 18MM X 1.0MM

Laird Technologies EMI
2,668 -

RFQ

- - Active Fabric Over Foam Rectangle 0.709 (18.00mm) 18.000 (457.20mm) 0.039 (1.00mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - -
4082PA51H03937

4082PA51H03937

GK,NICU,PTAFG,PU,V0,REC .100X.37

Laird Technologies EMI
2,464 -

RFQ

Bulk 51H Active Fabric Over Foam Rectangle 0.375 (9.53mm) 39.370 (1.00m) 0.100 (2.54mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive
4283PAX1R03937

4283PAX1R03937

GK,NICU,PTAFG,PU,V0,DSH .079X.15

Laird Technologies EMI
2,317 -

RFQ

Bulk EcoTemp™ 85 X1R Active Fabric Over Foam D-Shape 0.157 (3.99mm) 39.370 (1.00m) 0.080 (2.03mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive
8864-0100-72

8864-0100-72

OSTRHOL,CUSTMATL 3.18X1.14MM

Laird Technologies EMI
2,192 -

RFQ

Bulk Electroseal™ EcE72 Active - - - - - - - - -
8866-0130-72

8866-0130-72

DSTRHOL,CUSTMATL 2.54X2.39X1.00X

Laird Technologies EMI
2,010 -

RFQ

Bulk Electroseal™ EcE72 Active - - - - - - - - -
SG080275R-48.00

SG080275R-48.00

.080H X .275W X 48L--RECTANGU

Leader Tech Inc.
3,472 -

RFQ

SG080275R-48.00

Ficha técnica

Bulk - Active Fabric Over Foam Rectangle 0.275 (6.99mm) 4.00' (1.22m) 0.080 (2.03mm) Polyurethane Foam, Nickel-Copper Polyester (NI/CU) - - -
6-31CPG-SN-12

6-31CPG-SN-12

COPPER BERYLLIUM FINGERSTOCK EMI

Leader Tech Inc.
3,332 -

RFQ

6-31CPG-SN-12

Ficha técnica

Bulk Clip-On Active Fingerstock - 0.310 (7.87mm) 12.000 (304.80mm) 0.060 (1.52mm) Beryllium Copper Tin - Clip
4215PA51H04800

4215PA51H04800

GK NICU PTAFG PU V0 REC

Laird Technologies EMI
2,242 -

RFQ

4215PA51H04800

Ficha técnica

Bulk 51H Active Fabric Over Foam Rectangle 0.276 (7.00mm) 48.000 (121.92cm) 0.039 (1.00mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive
0097022117

0097022117

CSTR,STR,SNB

Laird Technologies EMI
3,214 -

RFQ

Bulk Contact Strip Active Fingerstock - - - - Beryllium Copper - - Slot
4357PA51H03937

4357PA51H03937

GK,NICU,PTAFG,PU,V0,REC .080X.39

Laird Technologies EMI
3,347 -

RFQ

Bulk 51H Active Fabric Over Foam Rectangle 0.394 (10.01mm) 39.370 (1.00m) 0.080 (2.03mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive
4684AB51K02000

4684AB51K02000

GK,NICU,NRS,PU,V0,REC .709X.370X

Laird Technologies EMI
3,090 -

RFQ

Bulk 51K Active Fabric Over Foam - - 20.000 (508.00mm) - Polyurethane Foam, Nickel-Copper Polyester (NI/CU) - - Adhesive
0097078002

0097078002

DCON,25P,BF .025X2.281X.693

Laird Technologies EMI
3,409 -

RFQ

Bulk - Active Fingerstock - 0.690 (17.53mm) 2.280 (57.91mm) 0.025 (0.64mm) Beryllium Copper Unplated - Slot
4176PA51H01800

4176PA51H01800

GASKET FAB/FOAM 20X457.2MM RECT

Laird Technologies EMI
3,776 -

RFQ

4176PA51H01800

Ficha técnica

Bulk 51H Active Fabric Over Foam Rectangle 0.787 (20.00mm) 18.000 (457.20mm) 0.394 (10.00mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive
4602AB51K04800

4602AB51K04800

GK NICU NRS PU V0 REC

Laird Technologies EMI
2,653 -

RFQ

4602AB51K04800

Ficha técnica

Bulk 51K Active Fabric Over Foam Rectangle 0.236 (6.00mm) 48.000 (121.92cm) 0.079 (2.00mm) Polyurethane Foam, Nickel-Copper Polyester (NI/CU) - - -
0098064517

0098064517

CLO,STR,DLN,SNB,USF

Laird Technologies EMI
3,939 -

RFQ

0098064517

Ficha técnica

Bulk Ultrasoft Clip-On Active Fingerstock - 0.210 (5.33mm) 24.000 (609.60mm) 0.070 (1.78mm) Beryllium Copper Tin 299.21µin (7.60µm) Clip
0097097517

0097097517

LS,STR,SNB,PSA

Laird Technologies EMI
3,733 -

RFQ

0097097517

Ficha técnica

Bulk Longitudinal Grounding Active Fingerstock - 0.800 (20.32mm) 18.750 (476.25mm) 0.300 (7.62mm) Beryllium Copper Tin 299.21µin (7.60µm) Hardware
4049PA51H03937

4049PA51H03937

GK,NICU,PTAFG,PU,V0,SQ 6.35X6.35

Laird Technologies EMI
2,847 -

RFQ

Bulk 51H Active Fabric Over Foam Square 0.250 (6.35mm) 39.370 (1.00m) 0.250 (6.35mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive
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1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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