Soquetes para CIs, Transistores

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
116-41-952-41-001000

116-41-952-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,529 -

RFQ

116-41-952-41-001000

Ficha técnica

Tube 116 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-91-952-41-001000

116-91-952-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,119 -

RFQ

116-91-952-41-001000

Ficha técnica

Tube 116 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
117-43-620-61-005000

117-43-620-61-005000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,008 -

RFQ

Tube * Active - - - - - - - - - - - - - -
117-93-620-61-005000

117-93-620-61-005000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,681 -

RFQ

Tube * Active - - - - - - - - - - - - - -
510-93-028-06-005001

510-93-028-06-005001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,384 -

RFQ

510-93-028-06-005001

Ficha técnica

Bulk 510 Active PGA 28 (6 x 6) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-028-06-005002

510-93-028-06-005002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,876 -

RFQ

510-93-028-06-005002

Ficha técnica

Bulk 510 Active PGA 28 (6 x 6) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-028-06-005003

510-93-028-06-005003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,227 -

RFQ

510-93-028-06-005003

Ficha técnica

Bulk 510 Active PGA 28 (6 x 6) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
714-93-264-31-018000

714-93-264-31-018000

SOCKET CARRIER DUAL INLINE 64POS

Mill-Max Manufacturing Corp.
3,509 -

RFQ

714-93-264-31-018000

Ficha técnica

Tube 714 Active DIP, 0.1 (2.54mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
APA-648-G-A1

APA-648-G-A1

ADAPTER PLUG

Samtec Inc.
2,864 -

RFQ

Bulk APA Active - 48 (2 x 24) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
122-13-650-41-001000

122-13-650-41-001000

CONN IC DIP SOCKET 50POS GOLD

Mill-Max Manufacturing Corp.
3,792 -

RFQ

122-13-650-41-001000

Ficha técnica

Tube 122 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
64-9518-10E

64-9518-10E

CONN IC DIP SOCKET 64POS GOLD

Aries Electronics
2,370 -

RFQ

64-9518-10E

Ficha técnica

Bulk 518 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
612-13-648-41-001000

612-13-648-41-001000

SOCKET CARRIER SLDRTL .600 48POS

Mill-Max Manufacturing Corp.
2,474 -

RFQ

612-13-648-41-001000

Ficha técnica

Tube 612 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-036-06-000002

510-91-036-06-000002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,258 -

RFQ

510-91-036-06-000002

Ficha técnica

Bulk 510 Active PGA 36 (6 x 6) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-036-06-000003

510-91-036-06-000003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,868 -

RFQ

510-91-036-06-000003

Ficha técnica

Bulk 510 Active PGA 36 (6 x 6) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-036-06-000001

510-91-036-06-000001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,567 -

RFQ

510-91-036-06-000001

Ficha técnica

Bulk 510 Active PGA 36 (6 x 6) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-41-964-41-003000

612-41-964-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
2,229 -

RFQ

612-41-964-41-003000

Ficha técnica

Tube 612 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-91-964-41-003000

612-91-964-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
3,445 -

RFQ

612-91-964-41-003000

Ficha técnica

Tube 612 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-43-428-61-001000

115-43-428-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,537 -

RFQ

Tube * Active - - - - - - - - - - - - - -
115-93-428-61-001000

115-93-428-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,352 -

RFQ

Tube * Active - - - - - - - - - - - - - -
115-93-628-61-001000

115-93-628-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,149 -

RFQ

Tube * Active - - - - - - - - - - - - - -
Total 21991 Record«Prev1... 579580581582583584585586...1100Next»
1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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