Soquetes para CIs, Transistores

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
614-93-964-41-001000

614-93-964-41-001000

SOCKET CARRIER LOWPRO .900 64POS

Mill-Max Manufacturing Corp.
3,687 -

RFQ

614-93-964-41-001000

Ficha técnica

Tube 614 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-964-41-001000

614-43-964-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
3,987 -

RFQ

614-43-964-41-001000

Ficha técnica

Tube 614 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-314-61-008000

116-43-314-61-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,875 -

RFQ

Tube * Active - - - - - - - - - - - - - -
116-93-314-61-008000

116-93-314-61-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,414 -

RFQ

Tube * Active - - - - - - - - - - - - - -
323-93-164-41-001000

323-93-164-41-001000

SOCKET 3 LEVEL WRAPOST SIP 64POS

Mill-Max Manufacturing Corp.
3,445 -

RFQ

323-93-164-41-001000

Ficha técnica

Tube 323 Active SIP 64 (1 x 64) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
517-83-361-18-101111

517-83-361-18-101111

CONN SOCKET PGA 361POS GOLD

Preci-Dip
3,982 -

RFQ

517-83-361-18-101111

Ficha técnica

Bulk 517 Active PGA 361 (18 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-43-316-61-003000

116-43-316-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,577 -

RFQ

Tube * Active - - - - - - - - - - - - - -
116-93-316-61-003000

116-93-316-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,938 -

RFQ

Tube * Active - - - - - - - - - - - - - -
110-43-432-61-001000

110-43-432-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,960 -

RFQ

Tube * Active - - - - - - - - - - - - - -
110-93-432-61-001000

110-93-432-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,986 -

RFQ

Tube * Active - - - - - - - - - - - - - -
612-43-952-41-004000

612-43-952-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
2,052 -

RFQ

612-43-952-41-004000

Ficha técnica

Tube 612 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-93-952-41-004000

612-93-952-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
3,299 -

RFQ

612-93-952-41-004000

Ficha técnica

Tube 612 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-93-322-61-105000

110-93-322-61-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,339 -

RFQ

Tube * Active - - - - - - - - - - - - - -
110-93-422-61-105000

110-93-422-61-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,800 -

RFQ

Tube * Active - - - - - - - - - - - - - -
714-93-264-31-007000

714-93-264-31-007000

SOCKET CARRIER DUAL INLINE 64POS

Mill-Max Manufacturing Corp.
3,983 -

RFQ

714-93-264-31-007000

Ficha técnica

Tube 714 Active DIP, 0.1 (2.54mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
48-6556-11

48-6556-11

CONN IC DIP SOCKET 48POS GOLD

Aries Electronics
2,513 -

RFQ

48-6556-11

Ficha técnica

Bulk 6556 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled
416-93-264-41-007000

416-93-264-41-007000

SOCKET DUAL INLINE ELEVATD 64POS

Mill-Max Manufacturing Corp.
2,618 -

RFQ

416-93-264-41-007000

Ficha técnica

Tube 416 Active DIP, 0.1 (2.54mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 30.0µin (0.76µm) - - Closed Frame - - - - - -
110-13-322-61-001000

110-13-322-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,552 -

RFQ

Tube * Active - - - - - - - - - - - - - -
110-13-422-61-001000

110-13-422-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,904 -

RFQ

Tube * Active - - - - - - - - - - - - - -
APA-640-G-M

APA-640-G-M

ADAPTER PLUG

Samtec Inc.
2,866 -

RFQ

Tube APA Active - 40 (2 x 20) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
Total 21991 Record«Prev1... 580581582583584585586587...1100Next»
1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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