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Soquetes para CIs, Transistores
| Foto: | Número da peça do fabricante | Disponibilidade | Preço | Quantidade | Ficha técnica | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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510-93-124-14-071003SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
3,921 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 124 (14 x 14) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
546-87-364-17-091147CONN SOCKET PGA 364POS GOLD Preci-Dip |
3,927 | - |
RFQ |
Ficha técnica |
Bulk | 546 | Active | PGA | 364 (17 x 17) | 0.050 (1.27mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100 (2.54mm) | Tin | - | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
510-93-125-13-041001SOCKET SOLDERTAIL 125-PGA Mill-Max Manufacturing Corp. |
3,873 | - |
RFQ |
Bulk | 510 | Active | PGA | 125 (13 x 13) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
|
|
510-93-125-14-071001SOCKET SOLDERTAIL 125-PGA Mill-Max Manufacturing Corp. |
3,583 | - |
RFQ |
Bulk | 510 | Active | PGA | 125 (14 x 14) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
|
|
510-93-125-13-041002SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
2,295 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 125 (13 x 13) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-93-125-13-041003SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
2,729 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 125 (13 x 13) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-93-125-14-071002SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
2,760 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 125 (14 x 14) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-93-125-14-071003SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
3,610 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 125 (14 x 14) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
546-87-365-14-000147CONN SOCKET PGA 365POS GOLD Preci-Dip |
3,771 | - |
RFQ |
Ficha técnica |
Bulk | 546 | Active | PGA | 365 (14 x 14) | 0.050 (1.27mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100 (2.54mm) | Tin | - | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
546-87-365-17-091147CONN SOCKET PGA 365POS GOLD Preci-Dip |
2,027 | - |
RFQ |
Ficha técnica |
Bulk | 546 | Active | PGA | 365 (17 x 17) | 0.050 (1.27mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100 (2.54mm) | Tin | - | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
117-43-668-61-105000CONN IC SKT DBL Mill-Max Manufacturing Corp. |
2,823 | - |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
550-80-296-19-131135PGA SOLDER TAIL Preci-Dip |
2,031 | - |
RFQ |
Ficha técnica |
Bulk | 550 | Active | PGA | 296 (19 x 19) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
514-83-279-19-081117CONN SOCKET PGA 279POS GOLD Preci-Dip |
3,689 | - |
RFQ |
Ficha técnica |
Bulk | 514 | Active | PGA | 279 (19 x 19) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
40-0511-11CONN SOCKET SIP 40POS GOLD Aries Electronics |
2,350 | - |
RFQ |
Ficha técnica |
Bulk | 511 | Active | SIP | 40 (1 x 40) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole | - | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
514-83-272M20-001148CONN SOCKET BGA 272POS GOLD Preci-Dip |
2,684 | - |
RFQ |
Ficha técnica |
Bulk | 514 | Active | BGA | 272 (20 x 20) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
558-10-255M16-001101PGA SOLDER TAIL 1.27MM Preci-Dip |
2,371 | - |
RFQ |
Ficha técnica |
Bulk | 558 | Active | PGA | 255 (16 x 16) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
120-PGM13015-11CONN SOCKET PGA GOLD Aries Electronics |
3,803 | - |
RFQ |
Ficha técnica |
Bulk | PGM | Active | PGA | - | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
44-3551-11CONN IC DIP SOCKET ZIF 44POS GLD Aries Electronics |
3,903 | - |
RFQ |
Ficha técnica |
Bulk | 55 | Active | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 44 (2 x 22) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
44-3552-11CONN IC DIP SOCKET ZIF 44POS GLD Aries Electronics |
2,105 | - |
RFQ |
Ficha técnica |
Bulk | 55 | Active | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 44 (2 x 22) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
44-3553-11CONN IC DIP SOCKET ZIF 44POS GLD Aries Electronics |
2,814 | - |
RFQ |
Ficha técnica |
Bulk | 55 | Active | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 44 (2 x 22) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
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