Soquetes para CIs, Transistores

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
510-93-132-13-041002

510-93-132-13-041002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,754 -

RFQ

510-93-132-13-041002

Ficha técnica

Bulk 510 Active PGA 132 (13 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-132-13-041003

510-93-132-13-041003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,656 -

RFQ

510-93-132-13-041003

Ficha técnica

Bulk 510 Active PGA 132 (13 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-132-14-071003

510-93-132-14-071003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,018 -

RFQ

510-93-132-14-071003

Ficha técnica

Bulk 510 Active PGA 132 (14 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-135-14-051001

510-93-135-14-051001

SOCKET SOLDERTAIL 135-PGA

Mill-Max Manufacturing Corp.
3,122 -

RFQ

Bulk 510 Active PGA 135 (14 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-135-14-051002

510-93-135-14-051002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,556 -

RFQ

510-93-135-14-051002

Ficha técnica

Bulk 510 Active PGA 135 (14 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-135-14-051003

510-93-135-14-051003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,412 -

RFQ

510-93-135-14-051003

Ficha técnica

Bulk 510 Active PGA 135 (14 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-133-13-045002

510-93-133-13-045002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,394 -

RFQ

510-93-133-13-045002

Ficha técnica

Bulk 510 Active PGA 133 (13 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-133-14-071002

510-93-133-14-071002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,733 -

RFQ

510-93-133-14-071002

Ficha técnica

Bulk 510 Active PGA 133 (14 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-133-14-071003

510-93-133-14-071003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,483 -

RFQ

510-93-133-14-071003

Ficha técnica

Bulk 510 Active PGA 133 (14 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
40-6575-11

40-6575-11

CONN IC DIP SOCKET ZIF 40POS TIN

Aries Electronics
3,215 -

RFQ

40-6575-11

Ficha técnica

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
514-83-292M20-001148

514-83-292M20-001148

CONN SOCKET BGA 292POS GOLD

Preci-Dip
3,628 -

RFQ

514-83-292M20-001148

Ficha técnica

Bulk 514 Active BGA 292 (20 x 20) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-13-089-12-051001

510-13-089-12-051001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,496 -

RFQ

510-13-089-12-051001

Ficha técnica

Bulk 510 Active PGA 89 (12 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-089-12-051002

510-13-089-12-051002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,595 -

RFQ

510-13-089-12-051002

Ficha técnica

Bulk 510 Active PGA 89 (12 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-41-209-17-081002

510-41-209-17-081002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,486 -

RFQ

510-41-209-17-081002

Ficha técnica

Bulk 510 Active PGA 209 (17 x 17) 0.100 (2.54mm) - - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-209-17-081003

510-91-209-17-081003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,646 -

RFQ

510-91-209-17-081003

Ficha técnica

Bulk 510 Active PGA 209 (17 x 17) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
546-83-321-17-101147

546-83-321-17-101147

CONN SOCKET PGA 321POS GOLD

Preci-Dip
2,770 -

RFQ

546-83-321-17-101147

Ficha técnica

Bulk 546 Active PGA 321 (17 x 17) 0.050 (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
64-9508-20

64-9508-20

CONN IC DIP SOCKET 64POS GOLD

Aries Electronics
2,912 -

RFQ

64-9508-20

Ficha técnica

Bulk 508 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
518-77-272M20-001105

518-77-272M20-001105

CONN SOCKET PGA 272POS GOLD

Preci-Dip
2,252 -

RFQ

518-77-272M20-001105

Ficha técnica

Bulk 518 Active PGA 272 (20 x 20) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050 (1.27mm) Gold Flash Brass FR4 Epoxy Glass
510-91-223-18-095001

510-91-223-18-095001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,523 -

RFQ

510-91-223-18-095001

Ficha técnica

Bulk 510 Active PGA 223 (18 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-223-18-095002

510-91-223-18-095002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,861 -

RFQ

510-91-223-18-095002

Ficha técnica

Bulk 510 Active PGA 223 (18 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Total 21991 Record«Prev1... 660661662663664665666667...1100Next»
1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Usuário