Soquetes para CIs, Transistores

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
510-93-136-14-051002

510-93-136-14-051002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,471 -

RFQ

510-93-136-14-051002

Ficha técnica

Bulk 510 Active PGA 136 (14 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-136-14-051003

510-93-136-14-051003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,540 -

RFQ

510-93-136-14-051003

Ficha técnica

Bulk 510 Active PGA 136 (14 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
40-6503-21

40-6503-21

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics
2,288 -

RFQ

40-6503-21

Ficha técnica

Bulk 503 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
40-6503-31

40-6503-31

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics
2,820 -

RFQ

40-6503-31

Ficha técnica

Bulk 503 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
510-41-176-15-061002

510-41-176-15-061002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,238 -

RFQ

510-41-176-15-061002

Ficha técnica

Bulk 510 Active PGA 176 (15 x 15) 0.100 (2.54mm) - - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-176-15-061001

510-91-176-15-061001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,727 -

RFQ

510-91-176-15-061001

Ficha técnica

Bulk 510 Active PGA 176 (15 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-176-15-061003

510-91-176-15-061003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,923 -

RFQ

510-91-176-15-061003

Ficha técnica

Bulk 510 Active PGA 176 (15 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-41-177-15-061002

510-41-177-15-061002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,434 -

RFQ

510-41-177-15-061002

Ficha técnica

Bulk 510 Active PGA 177 (15 x 15) 0.100 (2.54mm) - - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-177-15-061001

510-91-177-15-061001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,399 -

RFQ

510-91-177-15-061001

Ficha técnica

Bulk 510 Active PGA 177 (15 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-177-15-061002

510-91-177-15-061002

SOCKET SOLDERTAIL 177-PGA

Mill-Max Manufacturing Corp.
3,693 -

RFQ

Bulk 510 Active PGA 177 (15 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-177-15-061003

510-91-177-15-061003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,268 -

RFQ

510-91-177-15-061003

Ficha técnica

Bulk 510 Active PGA 177 (15 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-87-281-19-001112

614-87-281-19-001112

CONN SOCKET PGA 281POS GOLD

Preci-Dip
3,262 -

RFQ

614-87-281-19-001112

Ficha técnica

Bulk 614 Active PGA 281 (19 x 19) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-279-19-081112

614-87-279-19-081112

CONN SOCKET PGA 279POS GOLD

Preci-Dip
2,508 -

RFQ

614-87-279-19-081112

Ficha técnica

Bulk 614 Active PGA 279 (19 x 19) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-43-950-61-001000

116-43-950-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,751 -

RFQ

Tube * Active - - - - - - - - - - - - - -
116-93-950-61-001000

116-93-950-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,231 -

RFQ

Tube * Active - - - - - - - - - - - - - -
510-91-179-15-041002

510-91-179-15-041002

SOCKET SOLDERTAIL 179-PGA

Mill-Max Manufacturing Corp.
2,904 -

RFQ

Bulk 510 Active PGA 179 (15 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-179-15-041001

510-91-179-15-041001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,825 -

RFQ

510-91-179-15-041001

Ficha técnica

Bulk 510 Active PGA 179 (15 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-179-15-041003

510-91-179-15-041003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,414 -

RFQ

510-91-179-15-041003

Ficha técnica

Bulk 510 Active PGA 179 (15 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-179-18-095001

510-91-179-18-095001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,596 -

RFQ

510-91-179-18-095001

Ficha técnica

Bulk 510 Active PGA 179 (18 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-179-18-095002

510-91-179-18-095002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,737 -

RFQ

510-91-179-18-095002

Ficha técnica

Bulk 510 Active PGA 179 (18 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Total 21991 Record«Prev1... 662663664665666667668669...1100Next»
1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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