Soquetes para CIs, Transistores

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
510-91-223-18-095003

510-91-223-18-095003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,734 -

RFQ

510-91-223-18-095003

Ficha técnica

Bulk 510 Active PGA 223 (18 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-223-18-098001

510-91-223-18-098001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,087 -

RFQ

510-91-223-18-098001

Ficha técnica

Bulk 510 Active PGA 223 (18 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-223-18-098002

510-91-223-18-098002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,233 -

RFQ

510-91-223-18-098002

Ficha técnica

Bulk 510 Active PGA 223 (18 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-223-18-098003

510-91-223-18-098003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,903 -

RFQ

510-91-223-18-098003

Ficha técnica

Bulk 510 Active PGA 223 (18 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-173-16-005001

510-93-173-16-005001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,816 -

RFQ

510-93-173-16-005001

Ficha técnica

Bulk 510 Active PGA 173 (16 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-133-13-045001

510-93-133-13-045001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,374 -

RFQ

510-93-133-13-045001

Ficha técnica

Bulk 510 Active PGA 133 (13 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-133-13-045003

510-93-133-13-045003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,419 -

RFQ

510-93-133-13-045003

Ficha técnica

Bulk 510 Active PGA 133 (13 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-175-16-006002

510-91-175-16-006002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,973 -

RFQ

510-91-175-16-006002

Ficha técnica

Bulk 510 Active PGA 175 (16 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-175-16-006003

510-91-175-16-006003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,610 -

RFQ

510-91-175-16-006003

Ficha técnica

Bulk 510 Active PGA 175 (16 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-175-16-005001

510-91-175-16-005001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,129 -

RFQ

510-91-175-16-005001

Ficha técnica

Bulk 510 Active PGA 175 (16 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-175-16-005002

510-91-175-16-005002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,817 -

RFQ

510-91-175-16-005002

Ficha técnica

Bulk 510 Active PGA 175 (16 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-175-16-005003

510-91-175-16-005003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,698 -

RFQ

510-91-175-16-005003

Ficha técnica

Bulk 510 Active PGA 175 (16 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-175-16-006001

510-91-175-16-006001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,037 -

RFQ

510-91-175-16-006001

Ficha técnica

Bulk 510 Active PGA 175 (16 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
40-6556-31

40-6556-31

UNIV TEST SOCKET RECEPT 6556

Aries Electronics
2,091 -

RFQ

- 6556 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled
40-6556-21

40-6556-21

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics
2,345 -

RFQ

40-6556-21

Ficha técnica

Bulk 6556 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled
116-43-964-61-008000

116-43-964-61-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,452 -

RFQ

Tube * Active - - - - - - - - - - - - - -
116-93-964-61-008000

116-93-964-61-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,226 -

RFQ

Tube * Active - - - - - - - - - - - - - -
40-3503-21

40-3503-21

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics
2,772 -

RFQ

40-3503-21

Ficha técnica

Bulk 503 Active DIP, 0.3 (7.62mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
40-3503-31

40-3503-31

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics
3,184 -

RFQ

40-3503-31

Ficha técnica

Bulk 503 Active DIP, 0.3 (7.62mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
510-93-136-14-051001

510-93-136-14-051001

SOCKET SOLDERTAIL 136-PGA

Mill-Max Manufacturing Corp.
3,605 -

RFQ

Bulk 510 Active PGA 136 (14 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Total 21991 Record«Prev1... 661662663664665666667668...1100Next»
1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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