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Térmico - dissipadores de calor
| Foto: | Número da peça do fabricante | Disponibilidade | Preço | Quantidade | Ficha técnica | Packaging | Series | ProductStatus | Type | PackageCooled | AttachmentMethod | Shape | Length | Width | Diameter | FinHeight | PowerDissipation@TemperatureRise | ThermalResistance@ForcedAirFlow | ThermalResistance@Natural | Material |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
HSIB916-AAC, HEATSINK FOR IB916 / IB917 S iBASE Technology |
2,747 | - |
RFQ |
Box | - | Active | Top Mount | - | - | - | - | - | - | - | - | - | - | ||
|
|
HSIB909AC, HEATSINK FOR IB909 ONLY , (R iBASE Technology |
3,954 | - |
RFQ |
Box | - | Active | Top Mount | - | - | - | - | - | - | - | - | - | - | ||
|
|
HSIB908-BGA-1AC, HEATSINK FOR IB908 ONLY , (R iBASE Technology |
3,529 | - |
RFQ |
Box | - | Active | Top Mount | - | - | - | - | - | - | - | - | - | - | ||
|
|
HSIB818-IAC, HEATSINK FOR IB818-I50/I40/I iBASE Technology |
3,783 | - |
RFQ |
Box | - | Active | Top Mount | - | - | - | - | - | - | - | - | - | - | ||
|
|
HSET975-AHEATSINK WITH COOLER FOR ET975 ( iBASE Technology |
2,327 | - |
RFQ |
Box | - | Active | Top Mount | - | - | - | - | - | - | - | - | - | - | ||
|
|
HSIB897-BGAAC, HEATSINK FOR IB897, (ROHS) iBASE Technology |
2,285 | - |
RFQ |
Box | - | Active | IB897 | - | - | - | - | - | - | - | - | - | |||
|
|
HSIB811-IAC, HEATSINK FOR IB811-I30/I40/I iBASE Technology |
2,444 | - |
RFQ |
Box | - | Active | Top Mount | - | - | - | - | - | - | - | - | - | - | ||
|
|
HSIB919-AAC, HEATSINK FOR IB919 SERIES, ( iBASE Technology |
3,367 | - |
RFQ |
Box | - | Active | Top Mount | - | - | - | - | - | - | - | - | - | - | ||
|
|
HSET970-BHEATSINK WITH COOLER FOR ET970 ( iBASE Technology |
3,501 | - |
RFQ |
Box | - | Active | Top Mount | - | - | - | - | - | - | - | - | - | - | ||
|
|
HSIB899-BGA-AAC, HEATSINK FOR IB899 SERIES, ( iBASE Technology |
3,404 | - |
RFQ |
Box | - | Active | Top Mount | - | - | - | - | - | - | - | - | - | - | ||
|
|
HSIB906-BGAAC, HEATSINK FOR IB906F-1G, (ROH iBASE Technology |
2,517 | - |
RFQ |
Box | - | Active | Top Mount | - | - | - | - | - | - | - | - | - | - | ||
|
|
HSET976-AHEATSINK WITH COOLER FOR ET976 iBASE Technology |
2,374 | - |
RFQ |
Box | - | Active | - | - | - | - | - | - | - | - | - | - | - | ||
|
|
HSIB822-BAC, HEATSINK FOR IB822, (ROHS) iBASE Technology |
2,317 | - |
RFQ |
Box | - | Active | IB822 | - | - | - | - | - | - | - | - | - | |||
|
|
HSIB905-PGAAC, HEATSINK + FAN FOR IB905F, ( iBASE Technology |
2,464 | - |
RFQ |
Box | - | Active | Top Mount | - | - | - | - | - | - | - | - | - | - | ||
|
|
HSIB903-BGAAC, HEATSINK + FAN FOR IB903F/ I iBASE Technology |
3,368 | - |
RFQ |
Box | - | Active | Top Mount | - | - | - | - | - | - | - | - | - | - | ||
|
|
HSIB918-AAC, HEATSINK + FAN FOR IB918 SER iBASE Technology |
3,447 | - |
RFQ |
Box | - | Active | Top Mount | - | - | - | - | - | - | - | - | - | - | ||
|
274-3ABHEAT SINKS BOARD LEVEL PWR SEMI Wakefield-Vette |
3,727 | - |
RFQ |
Ficha técnica |
Bulk | 274 | Active | Board Level | Bolt On | Rectangular, Fins | 0.750 (19.05mm) | 0.520 (13.21mm) | - | 0.250 (6.35mm) | 2.0W @ 62°C | 9.00°C/W @ 400 LFM | - | Aluminum | |
|
|
281-2ABHEATSINK FOR TO220 Wakefield-Vette |
3,204 | - |
RFQ |
Ficha técnica |
Bulk | 281 | Active | Board Level | Bolt On and PC Pin | Rectangular, Fins | 0.750 (19.05mm) | 0.520 (13.21mm) | - | 0.500 (12.70mm) | 2.0W @ 50°C | 7.00°C/W @ 400 LFM | - | Aluminum | |
|
|
281-1ABHEATSINK FOR TO220 Wakefield-Vette |
2,840 | - |
RFQ |
Ficha técnica |
Bulk | 281 | Active | Board Level | Bolt On and PC Pin | Rectangular, Fins | 0.750 (19.05mm) | 0.520 (13.21mm) | - | 0.375 (9.53mm) | 2.0W @ 56°C | 8.00°C/W @ 400 LFM | - | Aluminum | |
|
HSS-B20-NP-01HEATSINK TO-220 4.1W ALUMINUM CUI Devices |
2,585 | - |
RFQ |
Ficha técnica |
Bag | HSS | Active | Board Level | - | Rectangular, Fins | 0.787 (20.00mm) | 0.775 (19.68mm) | - | 0.303 (7.70mm) | 4.1W @ 75°C | 7.05°C/W @ 200 LFM | 18.29°C/W | Aluminum |
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