Térmico - dissipadores de calor

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus Type PackageCooled AttachmentMethod Shape Length Width Diameter FinHeight PowerDissipation@TemperatureRise ThermalResistance@ForcedAirFlow ThermalResistance@Natural Material
233-60AB

233-60AB

HEATSINK TO-220 VERT/HORZ BLK

Wakefield-Vette
3,687 -

RFQ

233-60AB

Ficha técnica

Bulk 233 Active Board Level Bolt On Rectangular, Fins 0.600 (15.24mm) 0.570 (14.47mm) - 0.500 (12.70mm) 2.0W @ 58°C 11.00°C/W @ 400 LFM 29.00°C/W Aluminum
242-125ABE-22

242-125ABE-22

HEATSINK TO-220 LOW PROFILE

Wakefield-Vette
2,205 -

RFQ

242-125ABE-22

Ficha técnica

Bulk 242 Active Board Level, Vertical Bolt On and PC Pin Rectangular, Fins 1.285 (32.64mm) 0.984 (25.00mm) - 0.250 (6.35mm) 2.0W @ 48°C 6.20°C/W @ 400 LFM - Aluminum
593002B00000G

593002B00000G

BOARD LEVEL HEAT SINK

Aavid, Thermal Division of Boyd Corporation
3,966 -

RFQ

593002B00000G

Ficha técnica

Bulk Channel 5900 Active Board Level, Vertical Bolt On Rectangular, Fins 1.180 (29.97mm) 1.000 (25.40mm) - 0.500 (12.70mm) 1.0W @ 20°C 4.00°C/W @ 600 LFM 13.40°C/W Aluminum
V5616X-T

V5616X-T

HEATSINK ALUM ANOD

Assmann WSW Components
3,214 -

RFQ

V5616X-T

Ficha técnica

Bulk - Active Board Level Bolt On Rectangular, Fins 1.378 (35.00mm) 0.669 (17.00mm) - 0.512 (13.00mm) - - 17.00°C/W Aluminum
576802B03300G

576802B03300G

BOARD LEVEL HEAT SINK

Aavid, Thermal Division of Boyd Corporation
2,170 -

RFQ

576802B03300G

Ficha técnica

Bulk - Active Board Level, Vertical Clip and PC Pin Rectangular, Fins 0.748 (19.00mm) 0.500 (12.70mm) - 0.500 (12.70mm) 1.0W @ 30°C 7.00°C/W @ 400 LFM 27.30°C/W Aluminum
HSS-B20-043H-01

HSS-B20-043H-01

HEATSINK TO-220 2.9W ALUMINUM

CUI Devices
3,211 -

RFQ

HSS-B20-043H-01

Ficha técnica

Box HSS Active Board Level, Vertical PC Pin Rectangular, Angled Fins 0.211 (5.35mm) 0.874 (22.20mm) - 1.250 (31.75mm) 2.9W @ 75°C 8.18°C/W @ 200 LFM 26.13°C/W Aluminum
287-1ABHE

287-1ABHE

HEATSINK FOR TO220

Wakefield-Vette
3,544 -

RFQ

287-1ABHE

Ficha técnica

Bulk 287 Active Board Level, Vertical Bolt On and PC Pin Rectangular, Fins 1.180 (29.97mm) 1.000 (25.40mm) - 0.500 (12.70mm) 4.0W @ 65°C 7.80°C/W @ 200 LFM 16.20°C/W Aluminum
240-118ABHE-22

240-118ABHE-22

HEATSINK TO-220 TWISTED FIN

Wakefield-Vette
2,086 -

RFQ

240-118ABHE-22

Ficha técnica

Bulk 240 Active Board Level, Vertical Bolt On and PC Pin Rectangular, Fins 1.180 (29.97mm) 0.570 (14.47mm) - 0.500 (12.70mm) 4.0W @ 55°C 5.30°C/W @ 400 LFM 13.80°C/W Aluminum
HSS-B20-NP-14

HSS-B20-NP-14

HEATSINK TO-220 4.4W ALUMINUM

CUI Devices
3,797 -

RFQ

HSS-B20-NP-14

Ficha técnica

Bag HSS Active Top Mount Clip and Board Mounts Rectangular, Fins 0.375 (9.53mm) 0.985 (25.00mm) - 0.961 (24.40mm) 4.4W @ 75°C 4.51°C/W @ 200 LFM 17.05°C/W Aluminum
217-36CTRE6

217-36CTRE6

BOARD LEVEL HEAT SINKS

Wakefield-Vette
2,727 -

RFQ

217-36CTRE6

Ficha técnica

Tape & Reel (TR) 217 Active Top Mount SMD Pad Rectangular, Fins 0.740 (18.80mm) 0.600 (15.24mm) - 0.360 (9.14mm) 1.0W @ 55°C 16.00°C/W @ 200 LFM 55.00°C/W Copper
7019BG

7019BG

BOARD LEVEL HEAT SINK

Aavid, Thermal Division of Boyd Corporation
2,243 -

RFQ

7019BG

Ficha técnica

Bulk - Active Board Level Bolt On Rectangular, Fins 1.000 (25.40mm) 1.550 (39.37mm) - 0.375 (9.52mm) 3.0W @ 40°C 8.00°C/W @ 100 LFM 11.00°C/W Aluminum
HSS-B20-NP-13

HSS-B20-NP-13

HEATSINK TO-220 3.9W ALUMINUM

CUI Devices
3,037 -

RFQ

HSS-B20-NP-13

Ficha técnica

Bag HSS Active Board Level Bolt On Rectangular, Fins 0.700 (17.78mm) 1.750 (44.45mm) - 0.375 (9.52mm) 3.9W @ 75°C 5.88°C/W @ 200 LFM 19.22°C/W Aluminum
218-40CT3

218-40CT3

HEATSINK ALUM BLACK SMD

Wakefield-Vette
2,455 -

RFQ

218-40CT3

Ficha técnica

Bulk 218 Active Top Mount SMD Pad Rectangular, Fins 0.320 (8.13mm) 0.900 (22.86mm) - 0.400 (10.16mm) 2.0W @ 62°C 21.00°C/W @ 200 LFM 31.00°C/W Copper
HSS21-B20-P53

HSS21-B20-P53

HEAT SINK, STAMPING, TO-218/TO-2

CUI Devices
3,164 -

RFQ

HSS21-B20-P53

Ficha técnica

Box HSS Active Board Level PC Pin Rectangular, Fins 1.000 (25.40mm) 0.961 (24.40mm) - 0.500 (12.70mm) 3.58W @ 75°C 10.10°C/W @ 200 LFM 20.93°C/W Aluminum Alloy
218-40CT5

218-40CT5

HEATSINK ALUM NATURAL SMD

Wakefield-Vette
2,456 -

RFQ

218-40CT5

Ficha técnica

Bulk 218 Active Top Mount SMD Pad Rectangular, Fins 0.500 (12.70mm) 1.030 (26.16mm) - 0.400 (10.16mm) 2.3W @ 40°C 5.00°C/W @ 600 LFM 31.00°C/W Copper
V6534B-T

V6534B-T

HEATSINK ALUM ANOD

Assmann WSW Components
2,785 -

RFQ

V6534B-T

Ficha técnica

Bulk - Active Board Level, Vertical Thermal Tape, Adhesive (Not Included) Square, Fins 1.457 (37.00mm) 1.457 (37.00mm) - 0.551 (14.00mm) - - - Aluminum Alloy
HSB01-080808

HSB01-080808

HEAT SINK, BGA, 8.5 X 8.5 X 8 MM

CUI Devices
2,560 -

RFQ

HSB01-080808

Ficha técnica

Box HSB Active Top Mount Adhesive Square, Pin Fins 0.335 (8.50mm) 0.335 (8.50mm) - 0.315 (8.00mm) 1.9W @ 75°C 16.00°C/W @ 200 LFM 39.10°C/W Aluminum Alloy
HSS-B20-085H

HSS-B20-085H

HEATSINK TO-220 3.4W ALUMINUM

CUI Devices
2,446 -

RFQ

HSS-B20-085H

Ficha técnica

Bag HSS Active Board Level PC Pin Rectangular, Fins 0.303 (7.70mm) 0.775 (19.68mm) - 0.790 (20.00mm) 3.4W @ 75°C 7.46°C/W @ 200 LFM 22.06°C/W Aluminum
V7477X2

V7477X2

HEATSINK ALUM ANOD

Assmann WSW Components
2,548 -

RFQ

V7477X2

Ficha técnica

Tray - Active Top Mount PC Pin Square, Pin Fins 0.984 (25.00mm) 0.984 (25.00mm) - 0.500 (12.70mm) - - 11.00°C/W Aluminum
V2283E1

V2283E1

PROFILE HEATSINK, FLAT BACK, AL6

Assmann WSW Components
3,402 -

RFQ

V2283E1

Ficha técnica

Bulk - Active Top Mount Thermal Tape, Adhesive (Not Included) Square, Fins 0.276 (7.00mm) 0.276 (7.00mm) - 0.216 (5.50mm) - - 87.00°C/W Aluminum Alloy
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1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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