Térmico - dissipadores de calor

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus Type PackageCooled AttachmentMethod Shape Length Width Diameter FinHeight PowerDissipation@TemperatureRise ThermalResistance@ForcedAirFlow ThermalResistance@Natural Material
HSE-B508-045H

HSE-B508-045H

HEAT SINK, EXTRUSION, TO-220, 50

CUI Devices
2,954 -

RFQ

HSE-B508-045H

Ficha técnica

Box HSE Active Board Level, Vertical Bolt On and PC Pin Rectangular, Angled Fins 2.000 (50.80mm) 1.772 (45.00mm) - 0.500 (12.70mm) 9.3W @ 75°C 4.38°C/W @ 200 LFM 8.06°C/W Aluminum Alloy
HSE-B20630-040H-01

HSE-B20630-040H-01

HEAT SINK, EXTRUSION, TO-220, 63

CUI Devices
2,387 -

RFQ

HSE-B20630-040H-01

Ficha técnica

Box HSE Active Board Level, Vertical PC Pin Rectangular, Angled Fins 2.480 (63.00mm) 1.359 (34.50mm) - 0.492 (12.50mm) 9.1W @ 75°C 9.10°C/W @ 200 LFM 8.24°C/W Aluminum Alloy
690-3B

690-3B

HEATSINK EXTRUSION

Wakefield-Vette
3,072 -

RFQ

690-3B

Ficha técnica

Bulk 690 Active Board Level, Extrusion Bolt On Square, Fins 1.860 (47.24mm) 1.860 (47.24mm) - 1.310 (33.27mm) 7.5W @ 44°C 2.00°C/W @ 400 LFM - Aluminum
HSE-B500-04H

HSE-B500-04H

HEAT SINK, EXTRUSION, TO-220, 50

CUI Devices
2,197 -

RFQ

HSE-B500-04H

Ficha técnica

Box HSE Active Board Level, Vertical Bolt On and PC Pin Rectangular, Fins 1.969 (50.00mm) 1.378 (35.00mm) - 1.000 (25.40mm) 12.2W @ 75°C 2.88°C/W @ 200 LFM 8.05°C/W Aluminum Alloy
624-25ABT1E

624-25ABT1E

HEATSINK FOR 21MM BGA

Wakefield-Vette
3,772 -

RFQ

624-25ABT1E

Ficha técnica

Bulk 624 Active Top Mount Thermal Tape, Adhesive (Included) Square, Pin Fins 0.827 (21.00mm) 0.827 (21.00mm) - 0.250 (6.35mm) - 25.00°C/W @ 200 LFM - Aluminum
HSE-B20630-040H

HSE-B20630-040H

HEAT SINK, EXTRUSION, TO-220, 63

CUI Devices
2,266 -

RFQ

HSE-B20630-040H

Ficha técnica

Box HSE Active Board Level, Vertical Bolt On and PC Pin Rectangular, Angled Fins 2.480 (63.00mm) 1.378 (35.00mm) - 0.492 (12.50mm) 9.6W @ 75°C 3.76°C/W @ 200 LFM 7.81°C/W Aluminum Alloy
625-60AB

625-60AB

HEATSINK FOR 25MM BGA

Wakefield-Vette
2,015 -

RFQ

625-60AB

Ficha técnica

Bulk 625 Active Top Mount Thermal Tape, Adhesive (Included) Square, Pin Fins 0.984 (25.00mm) 0.984 (25.00mm) - 0.600 (15.24mm) - 8.00°C/W @ 200 LFM - Aluminum
628-25AB

628-25AB

HEATSINK FOR 45MM BGA

Wakefield-Vette
3,279 -

RFQ

628-25AB

Ficha técnica

Bulk 628 Active Top Mount Thermal Tape, Adhesive (Included) Square, Pin Fins 1.750 (44.45mm) 1.700 (43.18mm) - 0.250 (6.35mm) 4.5W @ 80°C 7.00°C/W @ 300 LFM - Aluminum
634-10AB

634-10AB

HEATSINK TO-220 VERT MT BLK 1

Wakefield-Vette
2,349 -

RFQ

634-10AB

Ficha técnica

Bulk 634 Active Board Level, Vertical Bolt On Rectangular, Fins 1.000 (25.40mm) 0.640 (16.26mm) - 0.640 (16.26mm) - - - Aluminum
HSE-B18317-035H-01

HSE-B18317-035H-01

HEAT SINK, EXTRUSION, TO-218, 31

CUI Devices
3,908 -

RFQ

HSE-B18317-035H-01

Ficha técnica

Box HSE Active Board Level, Vertical Clip and PC Pin Rectangular, Angled Fins 1.250 (31.75mm) 1.638 (41.60mm) - 0.984 (25.00mm) 10.0W @ 75°C 4.33°C/W @ 200 LFM 7.50°C/W Aluminum Alloy
HSE-B18381-035H-02

HSE-B18381-035H-02

HEAT SINK, EXTRUSION, TO-218, 38

CUI Devices
2,492 -

RFQ

HSE-B18381-035H-02

Ficha técnica

Box HSE Active Board Level, Vertical Clip and PC Pin Rectangular, Angled Fins 1.500 (38.10mm) 1.638 (41.60mm) - 0.984 (25.00mm) 12.0W @ 75°C 3.79°C/W @ 200 LFM 6.25°C/W Aluminum Alloy
630-45AB

630-45AB

HEATSINK FOR BGAS FIN HGT .45

Wakefield-Vette
2,737 -

RFQ

630-45AB

Ficha técnica

Bulk 630 Active Top Mount Thermal Tape, Adhesive (Not Included) Square, Pin Fins 1.378 (35.00mm) 1.378 (35.00mm) - 0.450 (11.43mm) - 4.00°C/W @ 400 LFM - Aluminum
529801B02100G

529801B02100G

BOARD LEVEL HEAT SINK

Aavid, Thermal Division of Boyd Corporation
2,208 -

RFQ

529801B02100G

Ficha técnica

Bulk - Active Board Level, Vertical Bolt On and PC Pin Rectangular, Fins 1.500 (38.10mm) 1.650 (41.91mm) - 1.000 (25.40mm) 5.0W @ 30°C 3.00°C/W @ 200 LFM 5.00°C/W Aluminum
634-15AB

634-15AB

HEATSINK SLIM VERT BLACK TO-220

Wakefield-Vette
2,830 -

RFQ

634-15AB

Ficha técnica

Bulk 634 Active Board Level, Vertical Bolt On Rectangular, Fins 1.500 (38.10mm) 0.640 (16.26mm) - 0.640 (16.26mm) 3.0W @ 50°C 2.00°C/W @ 300 LFM 50.00°C/W Aluminum
CSM221-28AE

CSM221-28AE

HEATSINK BLACK ANODIZED

Ohmite
3,527 -

RFQ

CSM221-28AE

Ficha técnica

Box CSM Active Board Level, Vertical Solderable Feet Rectangular, Fins 1.102 (28.00mm) 0.492 (12.50mm) - 1.228 (31.20mm) 5.0W @ 60°C - 12.80°C/W Aluminum
V2200N1-F-LP

V2200N1-F-LP

HEATSINK CPU W/ADHESIVE STAMPED

Assmann WSW Components
3,142 -

RFQ

V2200N1-F-LP

Ficha técnica

Bulk - Active Top Mount Thermal Tape, Adhesive (Included) Square, Fins 1.181 (30.00mm) 1.181 (30.00mm) - 0.512 (13.00mm) - - - Aluminum Alloy
PH3N-101.6-38.1-0.062-1A

PH3N-101.6-38.1-0.062-1A

PH3N NANO 101.6X38.1X0.062MM

t-Global Technology
3,727 -

RFQ

PH3N-101.6-38.1-0.062-1A

Ficha técnica

Bulk PH3n Obsolete Heat Spreader Adhesive Rectangular 4.000 (101.60mm) 1.500 (38.10mm) - 0.002 (0.06mm) - - - Copper
624-35ABT1E

624-35ABT1E

HEATSINK FOR 21MM BGA

Wakefield-Vette
3,132 -

RFQ

624-35ABT1E

Ficha técnica

Bulk 624 Active Top Mount Thermal Tape, Adhesive (Included) Square, Pin Fins 0.827 (21.00mm) 0.827 (21.00mm) - 0.350 (8.89mm) - 15.00°C/W @ 400 LFM - Aluminum
630-25ABT3

630-25ABT3

HEATSINK FOR 35MM BGA

Wakefield-Vette
2,234 -

RFQ

630-25ABT3

Ficha técnica

Bulk 630 Active Top Mount Thermal Tape, Adhesive (Not Included) Square, Pin Fins 1.378 (35.00mm) 1.378 (35.00mm) - 0.250 (6.35mm) - 7.00°C/W @ 500 LFM - Aluminum
630-25ABT4E

630-25ABT4E

HEATSINK FOR 35MM BGA

Wakefield-Vette
3,775 -

RFQ

630-25ABT4E

Ficha técnica

Bulk 630 Active Top Mount Thermal Tape, Adhesive (Not Included) Square, Pin Fins 1.378 (35.00mm) 1.378 (35.00mm) - 0.250 (6.35mm) - 7.00°C/W @ 500 LFM - Aluminum
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1500+
1500+ Média diária de RFQ
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20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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