Térmico - dissipadores de calor

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus Type PackageCooled AttachmentMethod Shape Length Width Diameter FinHeight PowerDissipation@TemperatureRise ThermalResistance@ForcedAirFlow ThermalResistance@Natural Material
HSS-B20-05H

HSS-B20-05H

HEATSINK TO-220 9.8W ALUMINUM

CUI Devices
2,715 -

RFQ

HSS-B20-05H

Ficha técnica

Bag HSS Active Board Level, Vertical Bolt On and PC Pin Rectangular, Fins 0.728 (18.50mm) 2.007 (50.98mm) - 1.614 (41.00mm) 9.8W @ 75°C 2.01°C/W @ 200 LFM 7.65°C/W Aluminum
335814B00000G

335814B00000G

HEAT SINK

Aavid, Thermal Division of Boyd Corporation
3,375 -

RFQ

335814B00000G

Ficha técnica

Bulk - Active Top Mount Thermal Tape, Adhesive (Included) Square, Fins 1.181 (30.00mm) 1.181 (30.00mm) - 0.354 (9.00mm) - 5.61°C/W @ 200 LFM 10.50°C/W Aluminum
335714B00000G

335714B00000G

HEAT SINK

Aavid, Thermal Division of Boyd Corporation
2,733 -

RFQ

335714B00000G

Ficha técnica

Bulk - Active Top Mount Thermal Tape, Adhesive (Included) Square, Fins 1.181 (30.00mm) 1.181 (30.00mm) - 0.275 (7.00mm) - 8.13°C/W @ 200 LFM 15.20°C/W Aluminum
V5236BP-T

V5236BP-T

HEATSINK ANOD ALUM SOT-32/TO-220

Assmann WSW Components
2,170 -

RFQ

V5236BP-T

Ficha técnica

Bulk - Active Board Level, Vertical Bolt On and Board Mounts Rectangular, Fins 1.189 (30.20mm) 1.000 (25.40mm) - 0.315 (8.00mm) - - 18.00°C/W Aluminum
254-195ABPE

254-195ABPE

HEATSINK TO PKG FOLDED FIN

Wakefield-Vette
3,537 -

RFQ

Bulk 254 Active Board Level, Vertical Bolt On and PC Pin Rectangular, Fins 1.966 (49.93mm) 1.900 (48.26mm) - 0.950 (24.13mm) 3.0W @ 20°C 3.30°C/W @ 200 LFM - Aluminum
XL25-35-35-10-T1-0.25

XL25-35-35-10-T1-0.25

CERAMIC HEAT SPREADER 35X35MM GR

t-Global Technology
2,745 -

RFQ

XL25-35-35-10-T1-0.25

Ficha técnica

Tray XL-25 Obsolete Heat Spreader Thermal Tape, Adhesive (Included) Square 1.378 (35.00mm) 1.378 (35.00mm) - 0.394 (10.00mm) - - - Ceramic
624-35AB

624-35AB

HEATSINK FOR 21MM BGA

Wakefield-Vette
3,489 -

RFQ

624-35AB

Ficha técnica

Bulk 624 Active Top Mount Thermal Tape, Adhesive (Included) Square, Pin Fins 0.827 (21.00mm) 0.827 (21.00mm) - 0.350 (8.89mm) - 15.00°C/W @ 400 LFM - Aluminum
625-25AB

625-25AB

HEATSINK FOR 25MM BGA

Wakefield-Vette
2,834 -

RFQ

625-25AB

Ficha técnica

Bulk 625 Active Top Mount Thermal Tape, Adhesive (Included) Square, Pin Fins 0.984 (25.00mm) 0.984 (25.00mm) - 0.250 (6.35mm) - 12.00°C/W @ 500 LFM - Aluminum
V2136N1-F

V2136N1-F

HEATSINK CPU W/ADHESIVE STAMPED

Assmann WSW Components
3,702 -

RFQ

V2136N1-F

Ficha técnica

Bulk - Active Top Mount Thermal Tape, Adhesive (Included) Square, Fins 1.575 (40.00mm) 1.575 (40.00mm) - 0.394 (10.00mm) - - - Aluminum Alloy
HSE-B20381-056H

HSE-B20381-056H

HEAT SINK, EXTRUSION, TO-220, 38

CUI Devices
2,009 -

RFQ

HSE-B20381-056H

Ficha técnica

Box HSE Active Board Level, Vertical Bolt On and PC Pin Rectangular, Angled Fins 1.500 (38.10mm) 1.378 (35.00mm) - 0.500 (12.70mm) 6.7W @ 75°C 3.53°C/W @ 200 LFM 11.19°C/W Aluminum Alloy
XL25-40-40-5-T1-0.25

XL25-40-40-5-T1-0.25

CERAMIC HEAT SPREADER 40X40MM GR

t-Global Technology
3,446 -

RFQ

XL25-40-40-5-T1-0.25

Ficha técnica

Tray XL-25 Obsolete Heat Spreader Thermal Tape, Adhesive (Included) Square 1.575 (40.00mm) 1.575 (40.00mm) - 0.197 (5.00mm) - - - Ceramic
630-25AB

630-25AB

HEATSINK FOR 35MM BGA

Wakefield-Vette
2,940 -

RFQ

630-25AB

Ficha técnica

Bulk 630 Active Top Mount Thermal Tape, Adhesive (Not Included) Square, Pin Fins 1.378 (35.00mm) 1.378 (35.00mm) - 0.250 (6.35mm) - 7.00°C/W @ 500 LFM - Aluminum
624-45AB

624-45AB

HEATSINK CPU 21MM SQ W/OUT ADH

Wakefield-Vette
2,670 -

RFQ

624-45AB

Ficha técnica

Bulk 624 Active Top Mount Thermal Tape, Adhesive (Not Included) Square, Pin Fins 0.827 (21.00mm) 0.827 (21.00mm) - 0.450 (11.43mm) - 15.00°C/W @ 200 LFM - Aluminum
578205B00000G

578205B00000G

HEATSINK TO-5 .5 BLACK

Aavid, Thermal Division of Boyd Corporation
2,532 -

RFQ

578205B00000G

Ficha técnica

Bag - Active Top Mount Press Fit Rectangular, Fins 0.500 (12.70mm) 0.830 (21.08mm) 0.316 (8.03mm) ID 0.395 (10.03mm) 1.4W @ 50°C 30.00°C/W @ 200 LFM 38.00°C/W Aluminum
CSM222-30AE

CSM222-30AE

HEATSINK BLACK ANODIZED

Ohmite
2,649 -

RFQ

CSM222-30AE

Ficha técnica

Box CSM Active Board Level, Vertical Solderable Feet Rectangular, Fins 1.173 (29.80mm) 0.562 (14.27mm) - 1.228 (31.20mm) 5.0W @ 60°C - 11.30°C/W Aluminum
628-20AB

628-20AB

HEATSINK FOR 45MM BGA

Wakefield-Vette
3,652 -

RFQ

628-20AB

Ficha técnica

Bulk 628 Active Top Mount Thermal Tape, Adhesive (Included) Square, Pin Fins 1.750 (44.45mm) 1.700 (43.18mm) - 0.200 (5.08mm) 4.0W @ 80°C 8.00°C/W @ 300 LFM - Aluminum
593202B03400G

593202B03400G

BOARD LEVEL HEAT SINK

Aavid, Thermal Division of Boyd Corporation
2,309 -

RFQ

593202B03400G

Ficha técnica

Bulk - Active Board Level, Vertical Bolt On and PC Pin Rectangular, Fins 2.000 (50.80mm) 1.380 (35.05mm) - 0.480 (12.19mm) 6.0W @ 60°C 5.00°C/W @ 200 LFM 10.40°C/W Aluminum
642-35AB

642-35AB

HEATSINK FOR 35MM BGA

Wakefield-Vette
2,591 -

RFQ

642-35AB

Ficha técnica

Bulk 642 Active Top Mount Thermal Tape, Adhesive (Not Included) Square, Fins 1.378 (35.00mm) 1.378 (35.00mm) - 0.350 (8.89mm) - 8.00°C/W @ 400 LFM - Aluminum
HSS28-B20-P39

HSS28-B20-P39

HEAT SINK, STAMPING, TO-218/TO-2

CUI Devices
2,026 -

RFQ

HSS28-B20-P39

Ficha técnica

Bag HSS Active Board Level Bolt On and PC Pin Square, Fins 0.748 (19.00mm) 0.748 (19.00mm) - 0.374 (9.50mm) 2.71W @ 75°C 12.00°C/W @ 200 LFM 27.66°C/W Aluminum Alloy
532602B00000

532602B00000

BOARD LEVEL HEAT SINK

Aavid, Thermal Division of Boyd Corporation
2,359 -

RFQ

532602B00000

Ficha técnica

Bulk - Active Board Level Bolt On Rectangular, Fins 1.500 (38.10mm) 1.650 (41.91mm) - 1.000 (25.40mm) 6.0W @ 40°C 2.00°C/W @ 400 LFM 5.50°C/W Aluminum
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1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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