Térmico - dissipadores de calor

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus Type PackageCooled AttachmentMethod Shape Length Width Diameter FinHeight PowerDissipation@TemperatureRise ThermalResistance@ForcedAirFlow ThermalResistance@Natural Material
625-60ABT4E

625-60ABT4E

HEATSINK FOR 25MM BGA

Wakefield-Vette
3,625 -

RFQ

625-60ABT4E

Ficha técnica

Bulk 625 Active Top Mount Thermal Tape, Adhesive (Included) Square, Pin Fins 0.984 (25.00mm) 0.984 (25.00mm) - 0.600 (15.24mm) - 8.00°C/W @ 200 LFM - Aluminum
625-60ABT5

625-60ABT5

HEATSINK FOR 25MM BGA

Wakefield-Vette
3,669 -

RFQ

625-60ABT5

Ficha técnica

Bulk 625 Active Top Mount Thermal Tape, Adhesive (Included) Square, Pin Fins 0.984 (25.00mm) 0.984 (25.00mm) - 0.600 (15.24mm) - 8.00°C/W @ 200 LFM - Aluminum
677-10ABPE

677-10ABPE

HEATSINK

Wakefield-Vette
3,470 -

RFQ

Bulk 677 Active Board Level, Vertical Bolt On and PC Pin Rectangular, Fins 1.000 (25.40mm) 1.650 (41.91mm) - 1.000 (25.40mm) - 3.10°C/W @ 200 LFM - Aluminum
677-20ABP

677-20ABP

HEATSINK MULTIWATT 2.0 BLK

Wakefield-Vette
2,341 -

RFQ

677-20ABP

Ficha técnica

Bulk 677 Active Board Level, Vertical Bolt On and PC Pin Rectangular, Fins 2.000 (50.80mm) 1.650 (41.91mm) - 1.000 (25.40mm) 6.0W @ 40°C 2.50°C/W @ 200 LFM 6.70°C/W Aluminum
658-45ABT6

658-45ABT6

HEATSINK CPU 28MM SQ BLK W/TAPE

Wakefield-Vette
3,298 -

RFQ

658-45ABT6

Ficha técnica

Bulk 658 Active Top Mount Thermal Tape, Adhesive (Not Included) Square, Pin Fins 1.100 (27.94mm) 1.100 (27.94mm) - 0.450 (11.43mm) 3.0W @ 50°C 6.00°C/W @ 200 LFM - Aluminum
502203B00000

502203B00000

HEAT SINK 6W/.75H SPACE SAVER

Aavid, Thermal Division of Boyd Corporation
3,466 -

RFQ

502203B00000

Ficha técnica

Bag - Active Board Level Bolt On Rhombus 1.630 (41.40mm) 1.290 (32.77mm) - 0.750 (19.05mm) - - - Aluminum
HSE-B18508-0396H

HSE-B18508-0396H

HEAT SINK, EXTRUSION, TO-218, 50

CUI Devices
3,435 -

RFQ

HSE-B18508-0396H

Ficha técnica

Box HSE Active Board Level, Vertical Bolt On and PC Pin Rectangular, Angled Fins 2.000 (50.80mm) 1.654 (42.00mm) - 0.984 (25.00mm) 12.8W @ 75°C 2.45°C/W @ 200 LFM 5.86°C/W Aluminum Alloy
658-60ABT5

658-60ABT5

HEATSINK EXTRUSION 27MM

Wakefield-Vette
2,778 -

RFQ

658-60ABT5

Ficha técnica

Bulk 658 Active Top Mount Thermal Tape, Adhesive (Not Included) Square, Pin Fins 1.100 (27.94mm) 1.100 (27.94mm) - 0.600 (15.24mm) 2.5W @ 30°C 2.00°C/W @ 500 LFM - Aluminum
TGH-0137-02

TGH-0137-02

ALUMINIUM HEAT SINK 25.6X13.7MM

t-Global Technology
3,585 -

RFQ

TGH-0137-02

Ficha técnica

Bulk - Active Board Level, Vertical PC Pin Rectangular, Fins 1.008 (25.60mm) 0.539 (13.70mm) - 0.472 (12.00mm) - - - Aluminum
628-20ABT1E

628-20ABT1E

HEATSINK FOR 45MM BGA

Wakefield-Vette
3,589 -

RFQ

628-20ABT1E

Ficha técnica

Bulk 628 Active Top Mount Thermal Tape, Adhesive (Included) Square, Pin Fins 1.750 (44.45mm) 1.700 (43.18mm) - 0.200 (5.08mm) 4.0W @ 80°C 8.00°C/W @ 300 LFM - Aluminum
628-20ABT4E

628-20ABT4E

HEATSINK FOR 45MM BGA

Wakefield-Vette
3,191 -

RFQ

628-20ABT4E

Ficha técnica

Bulk 628 Active Top Mount Thermal Tape, Adhesive (Included) Square, Pin Fins 1.750 (44.45mm) 1.700 (43.18mm) - 0.200 (5.08mm) 4.0W @ 80°C 8.00°C/W @ 300 LFM - Aluminum
628-20ABT5

628-20ABT5

HEATSINK FOR 45MM BGA

Wakefield-Vette
3,187 -

RFQ

628-20ABT5

Ficha técnica

Bulk 628 Active Top Mount Thermal Tape, Adhesive (Included) Square, Pin Fins 1.750 (44.45mm) 1.700 (43.18mm) - 0.200 (5.08mm) 4.0W @ 80°C 8.00°C/W @ 300 LFM - Aluminum
DV-T263-301E-TR

DV-T263-301E-TR

HEATSINK D2PAK TO-263 DEGREASED

Ohmite
2,363 -

RFQ

DV-T263-301E-TR

Ficha técnica

Tape & Reel (TR) D Active Top Mount Solderable Feet Rectangular, Fins 0.500 (12.70mm) 1.390 (35.31mm) - 0.460 (11.68mm) 6.0W @ 40°C 7.00°C/W @ 500 LFM - Aluminum
513302B02500G

513302B02500G

BOARD LEVEL HEAT SINK

Aavid, Thermal Division of Boyd Corporation
2,254 -

RFQ

513302B02500G

Ficha técnica

Bulk - Active Board Level, Vertical Bolt On and PC Pin Rectangular, Fins 2.500 (63.50mm) 1.375 (34.93mm) - 0.500 (12.70mm) 8.0W @ 60°C 4.00°C/W @ 200 LFM 8.00°C/W Aluminum
658-60ABT6

658-60ABT6

HEATSINK EXTRUSION 27MM

Wakefield-Vette
2,182 -

RFQ

658-60ABT6

Ficha técnica

Bulk 658 Active Top Mount Thermal Tape, Adhesive (Not Included) Square, Pin Fins 1.100 (27.94mm) 1.100 (27.94mm) - 0.600 (15.24mm) 2.5W @ 30°C 2.00°C/W @ 500 LFM - Aluminum
286-CTE

286-CTE

HEATSINK FOR TO220

Wakefield-Vette
2,145 -

RFQ

286-CTE

Ficha técnica

Bulk 286 Active Board Level, Vertical Bolt On and PC Pin Rectangular, Fins 1.190 (30.23mm) 1.000 (25.40mm) - 0.500 (12.70mm) 4.0W @ 58°C 7.40°C/W @ 200 LFM - Copper
677-25ABP

677-25ABP

HEATSINK MULTIWATT 2.5 BLK

Wakefield-Vette
2,182 -

RFQ

677-25ABP

Ficha técnica

Bulk 677 Active Board Level, Vertical Bolt On and PC Pin Rectangular, Fins 2.500 (63.50mm) 1.650 (41.91mm) - 1.000 (25.40mm) 6.0W @ 35°C 2.20°C/W @ 200 LFM - Aluminum
624-45ABT4E

624-45ABT4E

HEATSINK FOR 21MM BGA

Wakefield-Vette
2,474 -

RFQ

624-45ABT4E

Ficha técnica

Bulk 624 Active Top Mount Thermal Tape, Adhesive (Included) Square, Pin Fins 0.827 (21.00mm) 0.827 (21.00mm) - 0.450 (11.43mm) - 15.00°C/W @ 200 LFM - Aluminum
624-45ABT5

624-45ABT5

HEATSINK FOR 21MM BGA

Wakefield-Vette
3,825 -

RFQ

624-45ABT5

Ficha técnica

Bulk 624 Active Top Mount Thermal Tape, Adhesive (Included) Square, Pin Fins 0.827 (21.00mm) 0.827 (21.00mm) - 0.450 (11.43mm) - 15.00°C/W @ 200 LFM - Aluminum
628-25ABT4E

628-25ABT4E

HEATSINK FOR 45MM BGA

Wakefield-Vette
3,703 -

RFQ

628-25ABT4E

Ficha técnica

Bulk 628 Active Top Mount Thermal Tape, Adhesive (Included) Square, Pin Fins 1.750 (44.45mm) 1.700 (43.18mm) - 0.250 (6.35mm) 4.5W @ 80°C 7.00°C/W @ 300 LFM - Aluminum
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1500+
1500+ Média diária de RFQ
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20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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