Térmico - dissipadores de calor

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus Type PackageCooled AttachmentMethod Shape Length Width Diameter FinHeight PowerDissipation@TemperatureRise ThermalResistance@ForcedAirFlow ThermalResistance@Natural Material
628-40ABT5

628-40ABT5

HEATSINK FOR 45MM BGA

Wakefield-Vette
3,962 -

RFQ

628-40ABT5

Ficha técnica

Bulk 628 Active Top Mount Thermal Tape, Adhesive (Included) Square, Pin Fins 1.750 (44.45mm) 1.700 (43.18mm) - 4.000 (101.60mm) 2.5W @ 30°C 4.00°C/W @ 300 LFM - Aluminum
7129DG

7129DG

BOARD LEVEL HEAT SINK

Aavid, Thermal Division of Boyd Corporation
3,354 -

RFQ

7129DG

Ficha técnica

Bulk - Active Board Level Clip Rectangular, Fins 1.040 (26.42mm) 0.866 (22.00mm) - 0.375 (9.52mm) 3.5W @ 70°C 7.00°C/W @ 500 LFM 19.20°C/W Copper
553003B00000

553003B00000

BOARD LEVEL HEAT SINK

Aavid, Thermal Division of Boyd Corporation
2,885 -

RFQ

553003B00000

Ficha técnica

Bulk - Active Board Level Bolt On Square, Fins 1.780 (45.21mm) 1.780 (45.21mm) - 1.220 (31.00mm) 4.0W @ 30°C 2.00°C/W @ 400 LFM 6.60°C/W Aluminum
7178DG

7178DG

BOARD LEVEL HEAT SINK

Aavid, Thermal Division of Boyd Corporation
2,363 -

RFQ

7178DG

Ficha técnica

Bulk - Active Board Level, Vertical Bolt On and PC Pin Rectangular, Fins 0.750 (19.05mm) 0.520 (13.21mm) - 0.375 (9.52mm) 0.6W @ 30°C 5.00°C/W @ 700 LFM 35.70°C/W Copper
628-35ABT1E

628-35ABT1E

HEATSINK FOR 45MM BGA

Wakefield-Vette
3,157 -

RFQ

628-35ABT1E

Ficha técnica

Bulk 628 Active Top Mount Thermal Tape, Adhesive (Included) Square, Pin Fins 1.750 (44.45mm) 1.700 (43.18mm) - 0.350 (8.89mm) 3.0W @ 50°C 10.00°C/W @ 150 LFM - Aluminum
628-40ABT1E

628-40ABT1E

HEATSINK FOR 45MM BGA

Wakefield-Vette
2,698 -

RFQ

628-40ABT1E

Ficha técnica

Bulk 628 Active Top Mount Thermal Tape, Adhesive (Included) Square, Pin Fins 1.750 (44.45mm) 1.700 (43.18mm) - 4.000 (101.60mm) 2.5W @ 30°C 4.00°C/W @ 300 LFM - Aluminum
574602B03300G

574602B03300G

HEATSINK TO-220 CLIP-ON/TAB

Aavid, Thermal Division of Boyd Corporation
2,021 -

RFQ

574602B03300G

Ficha técnica

Bulk - Active Board Level, Vertical Clip and PC Pin Rectangular, Fins 0.690 (17.53mm) 0.860 (21.84mm) - 0.395 (10.03mm) 3.0W @ 60°C 6.00°C/W @ 600 LFM 21.60°C/W Aluminum
698-40AB

698-40AB

HEATSINK EXTRUSION 45MM

Wakefield-Vette
2,007 -

RFQ

698-40AB

Ficha técnica

Bulk 698 Active Top Mount Thermal Tape, Adhesive (Included) Square, Pin Fins 2.100 (53.34mm) 2.100 (53.34mm) - 0.400 (10.16mm) - 6.40°C/W @ 200 LFM - Aluminum
527-45AB

527-45AB

HEATSINK DC/DC HALF BRICK VERT

Wakefield-Vette
3,976 -

RFQ

527-45AB

Ficha técnica

Bulk 527 Active Board Level Bolt On, Thermal Material Rectangular, Fins 2.280 (57.91mm) 2.400 (60.96mm) - 0.950 (24.13mm) 7.0W @ 60°C 2.30°C/W @ 300 LFM - Aluminum
655-26ABT1E

655-26ABT1E

HEATSINK FOR 40MM BGA

Wakefield-Vette
3,856 -

RFQ

655-26ABT1E

Ficha técnica

Bulk 655 Active Top Mount Thermal Tape, Adhesive (Not Included) Square, Pin Fins 1.600 (40.64mm) 1.600 (40.64mm) - 0.260 (6.60mm) 5.0W @ 60°C 3.00°C/W @ 500 LFM - Aluminum
7148DG

7148DG

BOARD LEVEL HEAT SINK

Aavid, Thermal Division of Boyd Corporation
3,352 -

RFQ

7148DG

Ficha técnica

Bulk - Active Board Level, Vertical Clip and PC Pin Rectangular, Fins 0.795 (20.19mm) 0.915 (23.24mm) - 0.380 (9.65mm) 1.0W @ 30°C 6.00°C/W @ 600 LFM 16.00°C/W Copper
DA-T263-301E-TR

DA-T263-301E-TR

HEATSINK D2PAK TO-263 ANODIZED

Ohmite
3,193 -

RFQ

DA-T263-301E-TR

Ficha técnica

Tape & Reel (TR) D Active Top Mount Solderable Feet Rectangular, Fins 0.500 (12.70mm) 1.390 (35.31mm) - 0.460 (11.68mm) 6.0W @ 40°C 7.00°C/W @ 500 LFM - Aluminum
DA-T263-401E-TR

DA-T263-401E-TR

TO-263 SMD HEAT SINK ANODZD

Ohmite
3,908 -

RFQ

DA-T263-401E-TR

Ficha técnica

Tape & Reel (TR) D Active Top Mount Solderable Feet Rectangular, Fins 0.500 (12.70mm) 1.030 (26.16mm) - 0.460 (11.68mm) - - - Aluminum
662-15AGT5

662-15AGT5

HEATSINK EXTRUSION 45MM

Wakefield-Vette
3,961 -

RFQ

662-15AGT5

Ficha técnica

Bulk 662 Active Top Mount Thermal Tape, Adhesive (Included) Square, Pin Fins 1.713 (43.51mm) 1.713 (43.51mm) - 0.150 (3.81mm) 2.0W @ 30°C 8.00°C/W @ 200 LFM - Aluminum
655-26ABT4E

655-26ABT4E

HEATSINK FOR 40MM BGA

Wakefield-Vette
2,082 -

RFQ

655-26ABT4E

Ficha técnica

Bulk 655 Active Top Mount Thermal Tape, Adhesive (Not Included) Square, Pin Fins 1.600 (40.64mm) 1.600 (40.64mm) - 0.260 (6.60mm) 5.0W @ 60°C 3.00°C/W @ 500 LFM - Aluminum
576403B00000G

576403B00000G

BOARD LEVEL HEAT SINK

Aavid, Thermal Division of Boyd Corporation
2,527 -

RFQ

576403B00000G

Ficha técnica

Bulk - Active Board Level Bolt On Square, Pin Fins 1.810 (45.97mm) 1.810 (45.97mm) - 1.250 (31.75mm) 10.0W @ 50°C 1.50°C/W @ 600 LFM 5.10°C/W Aluminum
698-65AB

698-65AB

HEATSINK EXTRUSION 45MM

Wakefield-Vette
2,387 -

RFQ

698-65AB

Ficha técnica

Bulk 698 Active Top Mount Thermal Tape, Adhesive (Included) Square, Pin Fins 2.100 (53.34mm) 2.100 (53.34mm) - 0.650 (16.51mm) - 2.50°C/W @ 300 LFM - Aluminum
6084BG

6084BG

BOARD LEVEL HEAT SINK

Aavid, Thermal Division of Boyd Corporation
2,356 -

RFQ

6084BG

Ficha técnica

Bulk - Active Board Level Bolt On Rectangular, Fins 0.750 (19.05mm) 0.520 (13.21mm) - 0.330 (8.38mm) 1.0W @ 30°C 7.00°C/W @ 300 LFM 22.50°C/W Aluminum
662-15ABT5

662-15ABT5

HEATSINK EXTRUSION 45MM

Wakefield-Vette
2,617 -

RFQ

662-15ABT5

Ficha técnica

Bulk 662 Active Top Mount Thermal Tape, Adhesive (Included) Square, Pin Fins 1.713 (43.51mm) 1.713 (43.51mm) - 0.150 (3.81mm) 2.0W @ 30°C 8.00°C/W @ 200 LFM - Aluminum
662-15AGT3

662-15AGT3

HEATSINK EXTRUSION 45MM

Wakefield-Vette
2,016 -

RFQ

662-15AGT3

Ficha técnica

Bulk 662 Active Top Mount Thermal Tape, Adhesive (Included) Square, Pin Fins 1.713 (43.51mm) 1.713 (43.51mm) - 0.150 (3.81mm) 2.0W @ 30°C 8.00°C/W @ 200 LFM - Aluminum
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1500+
1500+ Média diária de RFQ
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20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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