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Térmico - dissipadores de calor
| Foto: | Número da peça do fabricante | Disponibilidade | Preço | Quantidade | Ficha técnica | Packaging | Series | ProductStatus | Type | PackageCooled | AttachmentMethod | Shape | Length | Width | Diameter | FinHeight | PowerDissipation@TemperatureRise | ThermalResistance@ForcedAirFlow | ThermalResistance@Natural | Material |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
D10850-40T3HEATSINK 128PQFP COMPOSITE Wakefield-Vette |
3,778 | - |
RFQ |
Ficha técnica |
Bulk | Deltem™ | Active | Top Mount | Thermal Tape, Adhesive (Included) | Square, Pin Fins | 0.850 (21.59mm) | 0.850 (21.59mm) | - | 0.400 (10.16mm) | 2.5W @ 90°C | 20.00°C/W @ 100 LFM | - | Composite | |
|
|
325705R00000GBOARD LEVEL HEAT SINK Aavid, Thermal Division of Boyd Corporation |
3,840 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Board Level | Press Fit | Cylindrical | - | - | 0.318 (8.07mm) ID, 0.500 (12.70mm) OD | 0.250 (6.35mm) | 1.0W @ 60°C | 35.00°C/W @ 200 LFM | 60.00°C/W | Aluminum | |
|
576203B00000GBOARD LEVEL HEAT SINK Aavid, Thermal Division of Boyd Corporation |
3,869 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Board Level | Bolt On | Square, Pin Fins | 1.810 (45.97mm) | 1.810 (45.97mm) | - | 0.750 (19.05mm) | 4.0W @ 30°C | 2.50°C/W @ 400 LFM | 6.20°C/W | Aluminum | |
|
|
657-25ABPESCHEATSINK TO-220 W/PINS BLK 2.5 Wakefield-Vette |
3,825 | - |
RFQ |
Ficha técnica |
Bulk | 657 | Active | Board Level, Vertical | Bolt On and PC Pin | Rectangular, Fins | 1.000 (25.40mm) | 1.650 (41.91mm) | - | 2.500 (63.50mm) | 6.0W @ 25°C | 2.70°C/W @ 200 LFM | - | Aluminum | |
|
|
1542500-1HTS795-1=HS UPLTD TE Connectivity AMP Connectors |
3,519 | - |
RFQ |
Bag | * | Active | - | - | - | - | - | - | - | - | - | - | - | ||
|
|
655-53ABT6HEATSINK FOR 40MM BGA Wakefield-Vette |
2,118 | - |
RFQ |
Ficha técnica |
Bulk | 655 | Active | Top Mount | Thermal Tape, Adhesive (Not Included) | Square, Pin Fins | 1.600 (40.64mm) | 1.600 (40.64mm) | - | 0.525 (13.34mm) | 4.0W @ 40°C | 2.00°C/W @ 400 LFM | - | Aluminum | |
|
BDN15-3CB/A01HEATSINK CPU W/ADHESIVE 1.51SQ CTS Thermal Management Products |
2,034 | - |
RFQ |
Ficha técnica |
Tray | BDN | Active | Top Mount | Thermal Tape, Adhesive (Included) | Square, Pin Fins | 1.510 (38.35mm) | 1.510 (38.35mm) | - | 0.355 (9.02mm) | - | 4.50°C/W @ 400 LFM | 15.10°C/W | Aluminum | |
|
|
655-53ABT3HEATSINK FOR 40MM BGA Wakefield-Vette |
3,815 | - |
RFQ |
Ficha técnica |
Bulk | 655 | Active | Top Mount | Thermal Tape, Adhesive (Not Included) | Square, Pin Fins | 1.600 (40.64mm) | 1.600 (40.64mm) | - | 0.525 (13.34mm) | 4.0W @ 40°C | 2.00°C/W @ 400 LFM | - | Aluminum | |
|
|
655-53ABT5HEATSINK FOR 40MM BGA Wakefield-Vette |
2,972 | - |
RFQ |
Ficha técnica |
Bulk | 655 | Active | Top Mount | Thermal Tape, Adhesive (Not Included) | Square, Pin Fins | 1.600 (40.64mm) | 1.600 (40.64mm) | - | 0.525 (13.34mm) | 4.0W @ 40°C | 2.00°C/W @ 400 LFM | - | Aluminum | |
|
|
527-24AB-T725HEATSINK DC/DC HALF BRICK VERT Wakefield-Vette |
3,418 | - |
RFQ |
Ficha técnica |
Bulk | 527 | Active | Board Level | Bolt On, Thermal Material | Rectangular, Fins | 2.280 (57.91mm) | 2.400 (60.96mm) | - | 0.950 (24.13mm) | 5.0W @ 60°C | 4.20°C/W @ 300 LFM | - | Aluminum | |
|
|
6045BBOARD LEVEL HEAT SINK Aavid, Thermal Division of Boyd Corporation |
2,172 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Board Level | Clip | Rectangular | 1.000 (25.40mm) | 0.750 (19.05mm) | - | 0.350 (8.89mm) | 1.0W @ 30°C | 16.00°C/W @ 200 LFM | 26.00°C/W | Aluminum | |
|
|
500303B00000GBOARD LEVEL HEAT SINK Aavid, Thermal Division of Boyd Corporation |
2,604 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Board Level | Bolt On | Square, Pin Fins | 1.810 (45.97mm) | 1.810 (45.97mm) | - | 1.000 (25.40mm) | 6.0W @ 40°C | 1.50°C/W @ 700 LFM | 5.80°C/W | Aluminum | |
|
|
530400B00100GBOARD LEVEL HEAT SINK Aavid, Thermal Division of Boyd Corporation |
2,507 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Board Level, Vertical | Bolt On and Board Mounts | Square, Angled Fins | 1.750 (44.45mm) | 0.490 (12.44mm) | - | 1.750 (44.45mm) | 4.0W @ 30°C | 2.00°C/W @ 400 LFM | 6.30°C/W | Aluminum | |
|
|
533102B02551GBOARD LEVEL HEAT SINK Aavid, Thermal Division of Boyd Corporation |
2,723 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Board Level, Vertical | Clip and PC Pin | Rectangular, Fins | 1.500 (38.10mm) | 1.375 (34.93mm) | - | 0.500 (12.70mm) | 8.0W @ 80°C | 3.00°C/W @ 500 LFM | 11.00°C/W | Aluminum | |
|
CR301-25AEALUMINUM HEATSINK 25MM BLK ANODI Ohmite |
2,094 | - |
RFQ |
Ficha técnica |
Box | CR | Active | Board Level, Vertical | 2 Clips and PC Pin | Rectangular, Fins | 0.984 (25.00mm) | 2.362 (60.00mm) | - | - | - | - | 8.10°C/W | Aluminum Alloy | |
|
|
657-20ABPESCHEATSINK TO-220 W/PINS BLK 2 Wakefield-Vette |
2,302 | - |
RFQ |
Ficha técnica |
Bulk | 657 | Active | Board Level, Vertical | Bolt On and PC Pin | Rectangular, Fins | 1.000 (25.40mm) | 1.650 (41.91mm) | - | 2.000 (50.80mm) | 6.0W @ 32°C | 2.90°C/W @ 200 LFM | - | Aluminum | |
|
|
530801B05150GBOARD LEVEL HEAT SINK Aavid, Thermal Division of Boyd Corporation |
3,227 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Board Level, Vertical | Clip and PC Pin | Rectangular, Fins | 1.840 (46.74mm) | 0.490 (12.44mm) | - | 1.750 (44.45mm) | 4.0W @ 30°C | 1.00°C/W @ 700 LFM | 6.30°C/W | Aluminum | |
|
|
7137DGBOARD LEVEL HEAT SINK Aavid, Thermal Division of Boyd Corporation |
3,229 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | Board Level, Vertical | Clip and PC Pin | Rectangular, Fins | 0.848 (21.55mm) | 0.900 (22.86mm) | - | 0.375 (9.52mm) | 1.5W @ 50°C | 10.00°C/W @ 200 LFM | 20.80°C/W | Copper | |
|
|
527-24AB-MEHEATSINK DC/DC HALF BRICK VERT Wakefield-Vette |
2,462 | - |
RFQ |
Ficha técnica |
Bulk | 527 | Active | Board Level | Bolt On, Thermal Material | Rectangular, Fins | 2.280 (57.91mm) | 2.400 (60.96mm) | - | 0.950 (24.13mm) | 5.0W @ 60°C | 4.20°C/W @ 300 LFM | - | Aluminum | |
|
|
341600F00000GHEATSINK Aavid, Thermal Division of Boyd Corporation |
2,625 | - |
RFQ |
Ficha técnica |
Bulk | - | Active | - | - | - | - | - | - | - | - | - | - | - |
- 1500+ Média diária de RFQ
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