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Térmico - dissipadores de calor
| Foto: | Número da peça do fabricante | Disponibilidade | Preço | Quantidade | Ficha técnica | Packaging | Series | ProductStatus | Type | PackageCooled | AttachmentMethod | Shape | Length | Width | Diameter | FinHeight | PowerDissipation@TemperatureRise | ThermalResistance@ForcedAirFlow | ThermalResistance@Natural | Material |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
XL25-40-40-2.0XL25 CERAMIC BOARD 40X40X2MM t-Global Technology |
2,897 | - |
RFQ |
Ficha técnica |
Box | XL-25 | Obsolete | Heat Spreader | - | Square | 1.575 (40.00mm) | 1.575 (40.00mm) | - | 0.079 (2.00mm) | - | - | - | Ceramic | |
|
|
XL25-10-10-2.0XL25 CERAMIC BOARD 10X10X2MM t-Global Technology |
2,309 | - |
RFQ |
Ficha técnica |
Box | XL-25 | Obsolete | Heat Spreader | - | Square | 0.394 (10.00mm) | 0.394 (10.00mm) | - | 0.079 (2.00mm) | - | - | - | Ceramic | |
|
|
XL25-30-30-2.0XL25 CERAMIC BOARD 30X30X2MM t-Global Technology |
2,854 | - |
RFQ |
Ficha técnica |
Box | XL-25 | Obsolete | Heat Spreader | - | Square | 1.181 (30.00mm) | 1.181 (30.00mm) | - | 0.079 (2.00mm) | - | - | - | Ceramic | |
|
C126-025-1AEHEATSINK FOR TO-126 25MM Ohmite |
3,343 | - |
RFQ |
Ficha técnica |
Box | C | Obsolete | Board Level, Vertical | Clip and PC Pin | Rectangular, Fins | 0.984 (25.00mm) | 1.280 (32.51mm) | - | 0.732 (18.60mm) | 3.5W @ 28°C | 6.00°C/W @ 500 LFM | - | Aluminum | |
|
C126-040-2VEHEATSINK FOR TO-126 40MM Ohmite |
2,154 | - |
RFQ |
Ficha técnica |
Box | C | Obsolete | Board Level, Vertical | 2 Clips and PC Pin | Rectangular, Fins | 1.575 (40.00mm) | 1.280 (32.51mm) | - | 0.732 (18.60mm) | - | - | - | Aluminum | |
|
C126-040-2AEHEATSINK FOR TO-126 40MM Ohmite |
2,740 | - |
RFQ |
Ficha técnica |
Box | C | Obsolete | Board Level, Vertical | 2 Clips and PC Pin | Rectangular, Fins | 1.575 (40.00mm) | 1.280 (32.51mm) | - | 0.732 (18.60mm) | - | - | - | Aluminum | |
|
C126-025-1VEHEATSINK FOR TO-126 25MM Ohmite |
3,239 | - |
RFQ |
Ficha técnica |
Box | C | Obsolete | Board Level, Vertical | Clip and PC Pin | Rectangular, Fins | 0.984 (25.00mm) | 1.280 (32.51mm) | - | 0.732 (18.60mm) | 3.5W @ 28°C | 6.00°C/W @ 500 LFM | - | Aluminum | |
|
0372504040CHIPSET COOLER CU #1 6500 RPM Molex |
3,976 | - |
RFQ |
Bulk | - | Obsolete | - | - | - | - | - | - | - | - | - | - | - | ||
|
|
0372505020CHIPSET COOLER #2 COPPER 6500RPM Molex |
2,163 | - |
RFQ |
Bulk | - | Obsolete | - | - | - | - | - | - | - | - | - | - | - | ||
|
V6534E1HEATSINK ALUM ANOD Assmann WSW Components |
2,885 | - |
RFQ |
Ficha técnica |
Bulk | - | Obsolete | Board Level, Vertical | PC Pin | Rectangular | 0.787 (20.00mm) | 0.984 (25.00mm) | - | 0.394 (10.00mm) | - | - | 35.00°C/W | Aluminum | |
|
V6534BHEATSINK ALUM ANOD Assmann WSW Components |
3,937 | - |
RFQ |
Ficha técnica |
Bulk | - | Obsolete | Board Level, Vertical | PC Pin | Rectangular, Fins | 0.787 (20.00mm) | 0.984 (25.00mm) | - | 0.394 (10.00mm) | - | - | 35.00°C/W | Aluminum | |
|
XLI98C-20-20-2.15XL25 CERAMIC 20X20MM W/LI98C ADH t-Global Technology |
3,028 | - |
RFQ |
Ficha técnica |
Box | XL-25 | Obsolete | Heat Spreader | Thermal Tape, Adhesive (Included) | Square | 0.787 (20.00mm) | 0.787 (20.00mm) | - | 0.085 (2.15mm) | - | - | - | Ceramic | |
|
|
XLI98C-30-30-2.15XL25 CERAMIC 30X30MM W/LI98C ADH t-Global Technology |
3,330 | - |
RFQ |
Ficha técnica |
Box | XL-25 | Obsolete | Heat Spreader | Thermal Tape, Adhesive (Included) | Square | 1.181 (30.00mm) | 1.181 (30.00mm) | - | 0.085 (2.15mm) | - | - | - | Ceramic | |
|
XLI98C-10-10-2.15XL25 CERAMIC 10X10MM W/LI98C ADH t-Global Technology |
3,568 | - |
RFQ |
Ficha técnica |
Box | XL-25 | Obsolete | Heat Spreader | Thermal Tape, Adhesive (Included) | Square | 0.394 (10.00mm) | 0.394 (10.00mm) | - | 0.085 (2.15mm) | - | - | - | Ceramic | |
|
|
XLI98-10-10-2.25XL25 CERAMIC 10X10MM W/LI98C ADH t-Global Technology |
3,849 | - |
RFQ |
Ficha técnica |
Box | XL-25 | Obsolete | Heat Spreader | Thermal Tape, Adhesive (Included) | Square | 0.394 (10.00mm) | 0.394 (10.00mm) | - | 0.089 (2.25mm) | - | - | - | Ceramic | |
|
|
XLI98-20-20-2.25XL25 CERAMIC 20X20MM W/LI98C ADH t-Global Technology |
2,542 | - |
RFQ |
Ficha técnica |
Box | XL-25 | Obsolete | Heat Spreader | Thermal Tape, Adhesive (Included) | Square | 0.787 (20.00mm) | 0.787 (20.00mm) | - | 0.089 (2.25mm) | - | - | - | Ceramic | |
|
DA-T263-201ETO-263 SMD HEAT SINK ANODZD Ohmite |
3,164 | - |
RFQ |
Ficha técnica |
Bulk | D | Discontinued at Mosen | Top Mount | Solderable Feet | Rectangular, Fins | 0.500 (12.70mm) | 1.020 (25.91mm) | - | 0.480 (12.19mm) | 2.0W @ 30°C | 8.00°C/W @ 500 LFM | - | Aluminum | |
|
|
DA-T268-301ETO-268 SMD HEAT SINK ANODZD Ohmite |
2,193 | - |
RFQ |
Ficha técnica |
Bulk | D | Discontinued at Mosen | Top Mount | Solderable Feet | Rectangular, Fins | 0.500 (12.70mm) | 1.580 (40.13mm) | - | 0.460 (11.68mm) | 7.0W @ 35°C | 4.00°C/W @ 700 LFM | - | Aluminum | |
|
DV-T263-201ETO-263 SMD HEAT SINK Ohmite |
3,475 | - |
RFQ |
Ficha técnica |
Bulk | D | Discontinued at Mosen | Top Mount | Solderable Feet | Rectangular, Fins | 0.500 (12.70mm) | 1.020 (25.91mm) | - | 0.480 (12.19mm) | 2.0W @ 30°C | 8.00°C/W @ 500 LFM | - | Aluminum | |
|
|
DV-T268-301ETO-268 SMD HEAT SINK Ohmite |
2,792 | - |
RFQ |
Ficha técnica |
Bulk | D | Discontinued at Mosen | Top Mount | Solderable Feet | Rectangular, Fins | 0.500 (12.70mm) | 1.580 (40.13mm) | - | 0.460 (11.68mm) | 7.0W @ 35°C | 4.00°C/W @ 700 LFM | - | Aluminum |
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