Térmico - dissipadores de calor

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus Type PackageCooled AttachmentMethod Shape Length Width Diameter FinHeight PowerDissipation@TemperatureRise ThermalResistance@ForcedAirFlow ThermalResistance@Natural Material
PH3N-100-100-0.07-1A

PH3N-100-100-0.07-1A

PH3N 100X100X0.07MM W/ADH

t-Global Technology
3,907 -

RFQ

PH3N-100-100-0.07-1A

Ficha técnica

Box PH3n Obsolete Heat Spreader Adhesive Square 3.937 (100.00mm) 3.937 (100.00mm) - 0.003 (0.07mm) - - - Copper
FEX35-35-21/T710/M2

FEX35-35-21/T710/M2

FAN AXIAL 34.6X19.8MM 5VDC 2510

CTS Thermal Management Products
3,481 -

RFQ

FEX35-35-21/T710/M2

Ficha técnica

Tray FEX Active Board Level with Fan Clip, Tape Square, Fins 1.378 (35.00mm) 1.378 (35.00mm) - 0.827 (21.00mm) - - 1.92°C/W -
335214B00000G

335214B00000G

HEAT SINK

Aavid, Thermal Division of Boyd Corporation
3,685 -

RFQ

335214B00000G

Ficha técnica

Bulk - Active Top Mount Thermal Tape, Adhesive (Included) Square, Fins 0.984 (25.00mm) 0.984 (25.00mm) - 0.394 (10.00mm) - 5.30°C/W @ 200 LFM 1.00°C/W Aluminum
335314B00000G

335314B00000G

HEAT SINK

Aavid, Thermal Division of Boyd Corporation
3,984 -

RFQ

335314B00000G

Ficha técnica

Bulk - Active Top Mount Thermal Tape, Adhesive (Included) Square, Fins 1.063 (27.00mm) 1.063 (27.00mm) - 0.433 (11.00mm) - 5.30°C/W @ 200 LFM 1.00°C/W Aluminum
566102B00000G

566102B00000G

BOARD LEVEL HEAT SINK

Aavid, Thermal Division of Boyd Corporation
2,862 -

RFQ

566102B00000G

Ficha técnica

Bulk - Active - - - - - - - - - - -
2332BG

2332BG

HEAT SINK

Aavid, Thermal Division of Boyd Corporation
2,361 -

RFQ

2332BG

Ficha técnica

Bulk - Active - - - - - - - - - - -
6260B-MT5

6260B-MT5

HEAT SINK

Aavid, Thermal Division of Boyd Corporation
3,218 -

RFQ

6260B-MT5

Ficha técnica

Bulk - Active - - - - - - - - - - -
6261B-MT5G

6261B-MT5G

HEAT SINK

Aavid, Thermal Division of Boyd Corporation
3,006 -

RFQ

6261B-MT5G

Ficha técnica

Bulk - Active - - - - - - - - - - -
335314B00032G

335314B00032G

HEAT SINK

Aavid, Thermal Division of Boyd Corporation
3,378 -

RFQ

335314B00032G

Ficha técnica

Bulk - Active Top Mount Thermal Tape, Adhesive (Included) Square, Fins 1.063 (27.00mm) 1.063 (27.00mm) - 0.433 (11.00mm) - 5.30°C/W @ 200 LFM 1.00°C/W Aluminum
533701B02552G

533701B02552G

HEAT SINK

Aavid, Thermal Division of Boyd Corporation
3,870 -

RFQ

533701B02552G

Ficha técnica

Bulk - Active Board Level, Vertical Clip and PC Pin Rectangular, Fins 1.000 (25.40mm) 1.650 (41.91mm) - 1.000 (25.40mm) 12.0W @ 70°C 4.00°C/W @ 200 LFM 5.70°C/W Aluminum
132-10B

132-10B

HEATSINK EXTRUDED

Wakefield-Vette
3,215 -

RFQ

132-10B

Ficha técnica

Bulk 132 Active Board Level Bolt On Rectangular, Fins 10.000 (254.00mm) 5.000 (127.00mm) - 2.250 (57.15mm) - 0.13°C/W @ 500 LFM 0.38°C/W Aluminum Alloy
132-10G

132-10G

HEATSINK EXTRUDED

Wakefield-Vette
2,468 -

RFQ

132-10G

Ficha técnica

Bulk 132 Active Board Level Bolt On Rectangular, Fins 10.000 (254.00mm) 5.000 (127.00mm) - 2.250 (57.15mm) - 0.13°C/W @ 500 LFM 0.38°C/W Aluminum Alloy
132-11B9

132-11B9

HEATSINK EXTRUDED

Wakefield-Vette
2,694 -

RFQ

132-11B9

Ficha técnica

Bulk 132 Active Board Level Bolt On Rectangular, Fins 11.000 (279.40mm) 5.000 (127.00mm) - 2.250 (57.15mm) - 0.12°C/W @ 500 LFM 0.37°C/W Aluminum Alloy
132-11G9

132-11G9

HEATSINK EXTRUDED

Wakefield-Vette
2,065 -

RFQ

132-11G9

Ficha técnica

Bulk 132 Active Board Level Bolt On Rectangular, Fins 11.000 (279.40mm) 5.000 (127.00mm) - 2.250 (57.15mm) - 0.12°C/W @ 500 LFM 0.37°C/W Aluminum Alloy
132-15.5B

132-15.5B

HEATSINK EXTRUDED

Wakefield-Vette
2,244 -

RFQ

132-15.5B

Ficha técnica

Bulk 132 Active Board Level Bolt On Rectangular, Fins 15.500 (393.70mm) 5.000 (127.00mm) - 2.250 (57.15mm) - 0.10°C/W @ 500 LFM 0.28°C/W Aluminum Alloy
6-1542004-7

6-1542004-7

HTS780-U=40MM HS ASSY ULTEM CL

TE Connectivity AMP Connectors
3,023 -

RFQ

6-1542004-7

Ficha técnica

Bag - Active Top Mount Clip Cylindrical - - 1.575 (40.00mm) OD - - - - Aluminum
1-1542004-5

1-1542004-5

HTS718-540=MICRO-FCPGA ASSY

TE Connectivity AMP Connectors
2,386 -

RFQ

1-1542004-5

Ficha técnica

Bag - Active Top Mount Clip Cylindrical - - 1.000 (25.40mm) OD 0.571 (14.50mm) - 5.99°C/W @ 200 LFM 14.00°C/W Aluminum
3-1542004-8

3-1542004-8

HTS747-U=27MM LOW P HS ASSY A-

TE Connectivity AMP Connectors
2,858 -

RFQ

Bag - Active - - - - - - - - - - -
1542330-3

1542330-3

HTS84-3=HS PLTD SLK SC

TE Connectivity AMP Connectors
3,133 -

RFQ

Bag - Active - - - - - - - - - - -
1963835-1

1963835-1

25MM HEATSINK ASSEMBLY

TE Connectivity AMP Connectors
3,092 -

RFQ

1963835-1

Ficha técnica

Bag - Active Top Mount Clip Cylindrical - - 1.375 (34.92mm) OD 0.442 (11.23mm) - 5.99°C/W @ 200 LFM 13.20°C/W Aluminum
Total 113324 Record«Prev1... 56395640564156425643564456455646...5667Next»
1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Usuário